新闻
- 2012.05.10
- TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]
- 2012.04.27
- TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors
- 2012.04.23
- “EOMIN” and “SAW devices” are added to the technical presentations page.
- 2012.04.16
- TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]
- 2012.04.12
- TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/201KB]
- 2012.04.11
- TAIYO YUDEN Announces Personnel Change[PDF/213KB]
- 2012.04.02
- TAIYO YUDEN Announces Posting of Extraordinary Losses Associated with the Results of Solicitation for Voluntary Retirement and Business Restructuring in Domestic and Overseas Subsidiaries
- 2012.03.30
- Notice of the Early Redemption at the Option of the Bond Holders
- 2012.04.12
- TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/201KB]
- 2012.04.11
- TAIYO YUDEN Announces Personnel Change[PDF/213KB]
- 2012.03.29
- TAIYO YUDEN Announces Personnel Change[PDF/212KB]
- 2011.12.20
- TAIYO YUDEN: Two Domestic Group Companies Acquire the OHSAS18001 Certification[PDF/231KB]
- 2011.10.18
- TAIYO YUDEN to Appear at China High-Tech Fair ELEXCON 2011 [Acrobat PDF458KB]
- 2011.09.29
- TAIYO YUDEN: Notice of Website Renewal TAIYO YUDEN Updates its WebsiteDesign while Upgrading and Expanding Product as wellas IR Information through a Full-Scale Renewal[Acrobat PDF467KB]
- 2011.09.13
- TAIYO YUDEN to Appear at KES-Korea Electronics Show 2011-[Acrobat PDF314KB]
- 2011.09.06
- TAIYO YUDEN to Appear at CEATEC JAPAN 2011[PDF/345KB]
- 2012.05.10
- TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]
- 2012.04.23
- “EOMIN” and “SAW devices” are added to the technical presentations page.
- 2012.04.16
- TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]
- 2011.09.26
- TAIYO YUDEN Begins Provision of Web-based Component Data Viewer “TY-COMPAS” Simple and Easy to Use Search and Browsing of the Latest Electronic Component Data-[Acrobat PDF285KB]
- 2011.09.13
- TAIYO YUDEN: Thin-Type Polyacene Capacitor Developed for Improved RatedVoltage and Reliability Developed for Smartphone’s LED Flash and SSD’s Uninterruptible Power Source Applications-[Acrobat PDF344KB]
- 2011.09.08
- TAIYO YUDEN Announces the World’s First Practicable Circuit Board Embedding of Gallium Arsenide Semiconductors – Further Application of the Embedded-parts Multilayer Wiring Substrate “-[Acrobat PDF357KB]
- 2011.06.30
- TAIYO YUDEN Announces Commercialization of the World’s First Multilayer Ceramic Capacitor with a Capacitance of 220µF High Value Multilayer Ceramic Capacitor Series Lineup Expansion[PDF/361KB]
- 2011.06.09
- TAIYO YUDEN Announces Production Expansion of an Innovative Copper-core Embedded-parts Multilayer Wiring Substrate “EOMIN®” Full-scale Launch into the Embedded-parts Circuit Board Market for Smart Phones and Tablet PCs[PDF/440KB]
- 2012.04.27
- TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors
- 2012.04.02
- TAIYO YUDEN Announces Posting of Extraordinary Losses Associated with the Results of Solicitation for Voluntary Retirement and Business Restructuring in Domestic and Overseas Subsidiaries
- 2012.03.30
- Notice of the Early Redemption at the Option of the Bond Holders
- 2012.03.06
- TAIYO YUDEN Announces the Results of Solicitation for Voluntary Retirement
- 2012.02.21
- Financial Results for the 3rd Quarter
- 2012.02.21
- Presentation Data of Earnings Release Conference for the 3rd Quarter
- 2011.12.26
- TAIYO YUDEN Announces an Earnings Forecast Revision along with an Expected Extraordinary Loss from Soliciting Employees for Voluntary Retirement
- 2011.11.18
- Presentation Data of Earnings Release Conference for the 2nd Quarter
- 2012.03.21
- TAIYO YUDEN will participate in China International Inport Expo.
- 2011.10.18
- TAIYO YUDEN will participate in ELEXCON 2011.
- 2011.09.29
- Update of “TAIYO YUDEN: Notice of Website Renewal” in “Press Release”.
- 2011.09.26
- Update of “TAIYO YUDEN Begins Provision of Web-based Component Data Viewer “TY-COMPAS”” in “Press Release”.
- 2011.09.13
- TAIYO YUDEN will participate in KES 2011.
- 2011.09.13
- Update of “Thin-Type Polyacene Capacitor Developed for Improved Rated Voltage and Reliability” in “Press Release”.
- 2011.09.08
- Update of “TAIYO YUDEN Announces the World’s First Practicable Circuit Board Embedding of Gallium Arsenide Semiconductors” in “Press Release”.
- 2011.09.06
- TAIYO YUDEN will participate in CEATEC 2011.
