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Electronic Components

モジュール

Main Products

- Power Supply Modules
- High frequency modules
- Embedded parts multilayer
wiring substrate

Net Sales
for the Year Ended March 31, 2012

Integrated Modules & Devices

From the fiscal year ending March 2013, the product segment has been changed to the Integrated Modules & Devices segment.

For the fiscal year ended March 31, 2012, module sales totaled ¥29,166 million, down 8.2% compared with the previous fiscal year. Although sales of high-frequency modules rose year-over-year, sales of power supply modules declined.

From the fiscal year ending March 2013, the product segment has been changed to the Integrated Modules & Devices segment, reflecting the business model for this product segment, and its focus on an increasing ratio of integrated devices, rather than the individual modules that were the core products in the past. This segment will now include SAW/FBAR devices, antennas and ceramic filters. The Company is building a firm production base for SAW/FBAR devices in response to rising demand from the growing smartphone and tablet PC markets, where we see an increase of the need for more of these components. TAIYO YUDEN is also aggressively targeting the market for super-high-end components with products such as the EOMIN®--embedded-parts multilayer wiring substrate (“component-on-chip”) which was developed using TAIYO YUDEN proprietary technology. In addition, this segment is also focused on the power supply business with recovery systems and other products for the energy market.

This new product segment, Integrated Modules & Devices now newly includes SAW/FBAR devices, antennas and ceramic filters.