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      • CERAMIC CAPACITORS

        • High Value Multilayer Ceramic Capacitors (High dielectric type)
        • Standard Multilayer Ceramic Capacitors (Temperature compensating type)
        • Multilayer Ceramic Capacitors for High Frequency Applications (1GHz+)
        • Super Low Distortion Multilayer Ceramic Capacitors (CFCAPTM)
        • Medium-high Voltage Multilayer Ceramic Capacitors
        • LW Reversal Decoupling Capacitors (LWDCTM)
        • Array Type Multilayer Ceramic Capacitors
        • High Reliability Application Multilayer Ceramic Capacitors
        • Axial Leaded Ceramic Capacitors
      • INDUCTORS

        • SMD Power Inductors (NR series/ NR series H type/ S type / V type)
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        • Wire-wound Chip Power Inductors (BR series)
        • Wire-wound Chip Power Inductors (CB series)
        • Multilayer Chip Power Inductors (CK series P type/NM series)
        • Wire-wound Chip Inductors
          (LB series)
        • Wire-wound Chip Inductors for Signal Lines (LB series M type/LE series M type)
        • Multilayer Chip Inductors
          (LK series)
        • Multilayer Chip Inductors
          (CK series/CK series S type)
        • Multilayer Chip Inductors for High Frequency Applications
          (HK series)
        • High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type/AQ series)
        • Axial Leaded Inductors
        • Radial Leaded Inductors
        • Balun Transformers
      • NOISE SUPPRESSION COMPONENTS

        • Multilayer Chip Bead Inductors (BK series)
        • Multilayer Chip Bead Inductors (BK array series)
        • Multilayer Chip Bead Inductors for Power Lines (BK series P type)
        • Chip Bead Inductors for Power Lines (FB series M type)
        • Leaded Ferrite Bead Inductors
        • Leaded Normal Mode Choke Coils for DC and signal lines
        • Multilayer EMI Suppression Filters
        • SMD Common Mode Filters for High-Speed Differential Signal lines
        • SMD Common Mode Filters for DC and signal lines
        • Leaded Common Mode Filters for DC and signal lines
        • Leaded Common Mode Choke Coils for AC lines
        • Ferrite Cores
        • Multilayer Chip Varistors
        • Multilayer Chip Varistors
          (Low capacitance type)
        • Ring Varistors
      • HIGH FREQUENCY PRODUCTS

        • Multilayer Ceramic Devices (Filters/Diplexers/Baluns)
        • SAW/FBAR Devices (Filters/Duplexers)
        • Chip Antennas
      • ENERGY DEVICE
        (SUPER CAPACITORS)

        • Coin Type Polyacene Capacitor
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        • Cylinder Type Lithium Ion Capacitor
      • FUNCTIONAL MODULES

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  • The product lineup of TAIYO YUDEN supports the rapidly progressing electronics industry through the ever-growing power of ideas and technical capabilities.
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News

  • Latest
  • Press Releases
  • Product
  • IR
  • Notifications
2012.05.10Product
TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]
2012.04.27IR
TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors
2012.04.23Product
“EOMIN” and “SAW devices” are added to the technical presentations page.
2012.04.16Product
TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]
2012.04.12Press Releases
TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/201KB]
2012.04.11Press Releases
TAIYO YUDEN Announces Personnel Change[PDF/213KB]
2012.04.02IR
TAIYO YUDEN Announces Posting of Extraordinary Losses Associated with the Results of Solicitation for Voluntary Retirement and Business Restructuring in Domestic and Overseas Subsidiaries
2012.03.30IR
Notice of the Early Redemption at the Option of the Bond Holders

Latest Information news listing

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2012.04.12Press Releases
TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/201KB]
2012.04.11Press Releases
TAIYO YUDEN Announces Personnel Change[PDF/213KB]
2012.03.29Press Releases
TAIYO YUDEN Announces Personnel Change[PDF/212KB]
2011.12.20Press Releases
TAIYO YUDEN: Two Domestic Group Companies Acquire the OHSAS18001 Certification[PDF/231KB]
2011.10.18Press Releases
TAIYO YUDEN to Appear at China High-Tech Fair ELEXCON 2011 [Acrobat PDF458KB]
2011.09.29Press Releases
TAIYO YUDEN: Notice of Website Renewal TAIYO YUDEN Updates its WebsiteDesign while Upgrading and Expanding Product as wellas IR Information through a Full-Scale Renewal[Acrobat PDF482KB]
2011.09.13Press Releases
TAIYO YUDEN to Appear at KES-Korea Electronics Show 2011-[Acrobat PDF324KB]
2011.09.06Press Releases
TAIYO YUDEN to Appear at CEATEC JAPAN 2011[PDF/345KB]

Press Release news listing

RSS

2012.05.10Product
TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]
2012.04.23Product
“EOMIN” and “SAW devices” are added to the technical presentations page.
2012.04.16Product
TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]
2011.09.26Product
TAIYO YUDEN Begins Provision of Web-based Component Data Viewer “TY-COMPAS” Simple and Easy to Use Search and Browsing of the Latest Electronic Component Data-[Acrobat PDF284KB]
2011.09.13Product
TAIYO YUDEN: Thin-Type Polyacene Capacitor Developed for Improved RatedVoltage and Reliability Developed for Smartphone’s LED Flash and SSD’s Uninterruptible Power Source Applications-[Acrobat PDF344KB]
2011.09.08Product
TAIYO YUDEN Announces the World’s First Practicable Circuit Board Embedding of Gallium Arsenide Semiconductors – Further Application of the Embedded-parts Multilayer Wiring Substrate “EOMIN®” in Communication Modules-[Acrobat PDF357KB]
2011.06.30Product
TAIYO YUDEN Announces Commercialization of the World’s First Multilayer Ceramic Capacitor with a Capacitance of 220µF High Value Multilayer Ceramic Capacitor Series Lineup Expansion[PDF/361KB]
2011.06.09Product
TAIYO YUDEN Announces Production Expansion of an Innovative Copper-core Embedded-parts Multilayer Wiring Substrate “EOMIN®” Full-scale Launch into the Embedded-parts Circuit Board Market for Smart Phones and Tablet PCs[PDF/440KB]

Product Information news listing

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2012.04.27IR
TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors
2012.04.02IR
TAIYO YUDEN Announces Posting of Extraordinary Losses Associated with the Results of Solicitation for Voluntary Retirement and Business Restructuring in Domestic and Overseas Subsidiaries
2012.03.30IR
Notice of the Early Redemption at the Option of the Bond Holders
2012.03.06IR
TAIYO YUDEN Announces the Results of Solicitation for Voluntary Retirement
2012.02.21IR
Financial Results for the 3rd Quarter
2012.02.21IR
Presentation Data of Earnings Release Conference for the 3rd Quarter
2011.12.26IR
TAIYO YUDEN Announces an Earnings Forecast Revision along with an Expected Extraordinary Loss from Soliciting Employees for Voluntary Retirement
2011.11.18IR
Presentation Data of Earnings Release Conference for the 2nd Quarter

IR news listing

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2012.03.21Notifications
TAIYO YUDEN will participate in China International Inport Expo.
2011.10.18Notifications
TAIYO YUDEN will participate in ELEXCON 2011.
2011.09.29Notifications
Update of “TAIYO YUDEN: Notice of Website Renewal” in “Press Release”.
2011.09.26Notifications
Update of “TAIYO YUDEN Begins Provision of Web-based Component Data Viewer “TY-COMPAS”” in “Press Release”.
2011.09.13Notifications
TAIYO YUDEN will participate in KES 2011.
2011.09.13Notifications
Update of “Thin-Type Polyacene Capacitor Developed for Improved Rated Voltage and Reliability” in “Press Release”.
2011.09.08Notifications
Update of “TAIYO YUDEN Announces the World’s First Practicable Circuit Board Embedding of Gallium Arsenide Semiconductors” in “Press Release”.
2011.09.06Notifications
TAIYO YUDEN will participate in CEATEC JAPAN 2011.

Notification news listing

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Product Information

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