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Latest Information news

2017

2017.05.22

Future Management Policies

2017.05.22

Earnings Release Conference

2017.05.22

Financial Results

2017.05.22

Financial Summary FY2008~FY2017

2017.05.18

[TY-COMPAS] TAIYO YUDEN releases TY-COMPASone , an offline app.

2017.05.18

Component Libraries for ADS, Genesys, ANSYS Designer, Microwave Office Simulators have been updated.

2017.05.01

TAIYO YUDEN Announces Head Office Relocation [PDF/348KB]

2017.04.18

“Taiyo Yuden Components Selection Guide & Data Library”, “S-parameter”,“SPICE model”and “Simulator for EMC Components” have been updated.(Design Support Tools)

2017.03.30

TAIYO YUDEN Develops Automotive SMD Power Inductors with an Operating Temperature of up to 150°C [PDF/418KB]

2017.03.10

TAIYO YUDEN Announces Personnel Change [PDF/202KB]

2017.03.08

TAIYO YUDEN Commercializes 0201 Size High Frequency Multilayer Ceramic Capacitor [PDF/509KB]

2017.03.07

TAIYO YUDEN to Appear at electronica China 2017 [PDF/466KB]

2017.02.15

Earnings Release Conference for the 3rd Quarter

2017.02.15

Financial Results for the 3rd Quarter

2017.02.15

TAIYO YUDEN Revises Forecasts of Results

2016.11.22

TAIYO YUDEN Announces New Proposal for Chip Bead Inductors [PDF/404KB]

2016.11.15

Earnings Release Conference for the 2nd Quarter

2016.11.15

Financial Results for the 2nd Quarter

2016.11.15

TAIYO YUDEN Announces the Reasons for Differences between Consolidated Forecasts and Actual Results, and Earnings Forecast Revisions

2016.11.07

Component Library for Keysight Genesys simulator is available now. Component Library for ADS simulator has been updated.

2016.11.01

TAIYO YUDEN to Appear at electronica 2016 [PDF/290KB]

2016.10.19

“Taiyo Yuden Components Selection Guide & Data Library”, “S-parameter”,“SPICE model”and “Simulator for EMC Components” have been updated.(Design Support Tools)

2016.10.04

TAIYO YUDEN and Aroma Bit Signs Joint Development Agreement for Odor Sensor [PDF/247KB]

2016.09.28

TAIYO YUDEN to commercialize Bluetooth(R) v4.1 dual-mode modules [PDF/475KB]

2016.09.27

TAIYO YUDEN Achieves the Industry’s Largest Capacitance with its Low-Profile Ceramic Capacitors [PDF/520KB]

2016.09.20

TAIYO YUDEN to Appear at CEATEC JAPAN 2016 [PDF/446KB]

2016.09.16

Annual Report 2016

2016.09.16

Annual Report 2016 (HTML)

2016.08.18

Financial Results for the 1st Quarter

2016.08.18

Earnings Release Conference for the 1st Quarter

2016.08.17

TAIYO YUDEN to Appear at ELEXCON2016 [PDF/465KB]

2016.08.01

TAIYO YUDEN Announces the Release of the 2016 Safety & Environmental Report [PDF/228KB]

2016.07.25

TAIYO YUDEN and GE Ventures Collaborate On Microelectronics Embedding Technology for Next-Generation Semiconductors [PDF/436KB]

2016.07.01

Voting count results of the 75th ordinary general meeting of shareholders

2016.06.13

Component library for CR8000, CR-5000 Lightning has been updated.

2016.06.01

Component Libraries for ADS, ANSYS Designer, Microwave Office Simulators have been updated.

2016.06.01

Notice of convocation of the 75th ordinary general meeting of shareholders

2016.05.23

Financial Summary FY2007~FY2016

2016.05.23

Future Management Policies

2016.05.23

Earnings Release Conference

2016.05.23

Financial Results

2016.04.26

[TY-COMPAS] A feature to propose higher quality products is released on product detail pages.

2016.04.08

Apology on our website

2016.04.06

“Taiyo Yuden Components Selection Guide & Data Library”,“S-parameter”,“SPICE model”and “Simulator for EMC Components” have been updated.(Design Support Tools)

2016.04.05

TAIYO YUDEN Commercializes New Wireless Module Meeting High-Speed Wireless Communication Standards [PDF/408KB]

2016.03.31

TAIYO YUDEN Adds High-Performance Bluetooth(R) Smart Modules [PDF/435KB]

2016.03.09

TAIYO YUDEN to Appear at electronic China 2016 [PDF/456KB]

2016.02.16

TAIYO YUDEN Introduces the Thinnest 0603-Size Multilayer Ceramic Capacitor in the World, With a Thickness of 0.11 mm [PDF/398KB]

2016.02.15

Earnings Release Conference for the 3rd Quarter

2016.02.15

Financial Results for the 3rd Quarter

2016.02.03

Completion Ceremony for Second Plant of Subsidiary NIIGATA TAIYO YUDEN CO., LTD. [PDF/380KB]

2016.02.02

TAIYO YUDEN Announces Change in Director (Obituary Notice)

2015.12.15

Notice of Establishment of "Basic Policy for Corporate Governance"

2015.11.25

Component Library for ADS Simulator has been updated.

2015.11.17

Earnings Release Conference for the 2nd Quarter

2015.11.17

Financial Results for the 2nd Quarter

2015.11.17

Differences between Consolidated Forecasts and Actual Results, and Earnings Forecast Revisions

2015.11.12

TAIYO YUDEN to Appear at Intersolar India [PFD/266KB]

2015.11.10

TAIYO YUDEN to Appear at China Hi-Tech Fair ELEXCON2015 [PDF/410KB]

2015.11.04

“Taiyo Yuden Components Selection Guide & Data Library”, “S-parameter”,“SPICE model”and “Simulator for EMC Components” have been updated.(Design Support Tools)

2015.10.13

TAIYO YUDEN Announces Personnel Change [PDF/200KB]

2015.10.13

TAIYO YUDEN Announces a Change in Its Representative Directors

2015.09.30

TAIYO YUDEN Adds ME Series to Its Metal Power Inductor MCOIL(TM) [PDF/435KB]

2015.09.30

Annual Report 2015

2015.09.30

Annual Report 2015 (HTML)

2015.09.29

TAIYO YUDEN Announces Personnel Change [PDF/214KB]

2015.09.24

TAIYO YUDEN Extends Lineup of Bluetooth(R) Smart Modules [PDF/422KB]

2015.09.17

TAIYO YUDEN to Appear at CEATEC JAPAN 2015 [PDF/413KB]

2015.09.17

TAIYO YUDEN Extends its Lineup of Large-Capacitance Multilayer Ceramic Capacitors [PDF/415KB]

2015.09.01

TAIYO YUDEN Commences Sales of ELNA’s High-Reliability Aluminum Electrolytic Capacitors [PDF/243KB]

2015.08.24

Earnings Release Conference for the 1st Quarter

2015.08.24

Financial Results for the 1st Quarter

2015.08.24

Financial Statements

2015.07.31

TAIYO YUDEN Announces the Release of the 2015 Safety & Environmental Report [PDF/225KB]

2015.07.16

TAIYO YUDEN Commercializes Wireless Module Equipped with a Dual-Band Antenna [PDF/483KB]

2015.07.16

Component library for CR8000, CR-5000 Lightning has been updated.

2015.06.30

Voting Count Results

2015.06.24

TAIYO YUDEN Commercializes the World’s First 0.022μF 008004 Size (0.25×0.125mm) Multilayer Ceramic Capacitor [PDF/437KB]

2015.06.18

TAIYO YUDEN Announces New Proposal of Embedded-Parts Multilayer Wiring Substrate “EOMIN™” for Double-Lens Cameras [PDF/267KB]

2015.06.11

Withdrawal from the Recording Media Business [PDF/203KB]

2015.06.10

TAIYO YUDEN Announces Name Change for Consolidated Subsidiary Companies [PDF/373KB]

2015.06.05

Component Libraries for ADS, ANSYS Designer, Microwave Office Simulators have been updated.

2015.06.03

Notice of convocation of the 74rd ordinary general meeting of shareholders

2015.06.03

Financial Summary FY2006~FY2015

2015.06.03

Consolidated Financial Results for the Year Ended March 31, 2015 and Future Management Policies

2015.06.03

Earnings Release Conference

2015.06.03

Financial Results

2015.05.27

TAIYO YUDEN Adds High-Frequency Medium-High Voltage Multilayer Ceramic Capacitors to its High-Reliability Product Lineup [PDF/590KB]

2015.04.10

TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors

2015.04.09

“Taiyo Yuden Components Selection Guide”, “Data Library”, “S-parameter”,“SPICE model”and “Simulator for EMC Components” have been updated.(Design Support Tools)

2015.03.19

TAIYO YUDEN Announces Personnel Change [PDF/212KB]

2015.03.11

TAIYO YUDEN to Appear at electronica China 2015 [PDF/348KB]

2015.03.04

TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award [PDF/376KB]

2015.03.04

TAIYO YUDEN Announces Personnel Change [PDF/229KB]

2015.02.20

Financial Results for the 3rd Quarter

2015.02.20

Earnings Release Conference for the 3rd Quarter

2015.02.05

Apology on our website

2015.01.22

TAIYO YUDEN Adds a New Size to Metal Power Inductor MCOIL(TM) MD Series [PDF/511KB]

2014.12.16

Ceramic Capacitor Q&A Corner has been opened.

2014.11.20

TAIYO YUDEN Starts the Commercialization of Power Modules for LED Lighting[PDF/417KB]

2014.11.20

Capital and Business Alliance with ELNA Co., Ltd.

2014.11.20

Financial Results for the 2nd Quarter

2014.11.20

Earnings Release Conference for the 2nd Quarter

2014.11.20

Difference between Consolidated Forecast and Actual Results

2014.11.19

TAIYO YUDEN Announces the Construction of a New Plant at its Subsidiary NIIGATA TAIYO YUDEN CO., LTD. [PDF/433KB]

2014.11.10

TAIYO YUDEN to Appear at China Hi-Tech Fair ELEXCON2014 [PDF/392KB]

2014.10.30

TAIYO YUDEN Introduces its Website for Medical and Healthcare Devices [PDF/564KB]

2014.10.24

“Simulator for EMC Components” has been updated.(Design Support Tools)

2014.10.20

TAIYO YUDEN Announces Personnel Change[PDF/193KB]

2014.10.16

Financial Statements

2014.10.16

Annual Report 2014(HTML)

2014.10.14

“Taiyo Yuden Components Selection Guide & Data Library”, “S-parameter” and “SPICE model” have been updated.(Design Support Tools)

2014.09.30

TAIYO YUDEN Announces the Addition of High Specification Products to Its Metal Power Inductor “MCOIL(TM)” MA Series [PDF/430KB]

2014.09.30

Annual Report 2014

2014.09.25

TAIYO YUDEN Starts the Commercialization of the World’s First 470μF Multilayer Ceramic Capacitor [PDF/400KB]

2014.09.24

TAIYO YUDEN Starts the Commercialization of the 008004 Size (0.25×0.125mm) Multilayer Ceramic Capacitor [PDF/586KB]

2014.09.18

TAIYO YUDEN to Appear at CEATEC 2014 [PDF/346KB]

2014.09.11

TAIYO YUDEN Establishes Sales Office in Wuhan, China[PDF/468KB]

2014.09.08

TAIYO YUDEN Announces the Start of Development on Large-size Module Technology Based on its Embedded-Parts Multilayer Wiring Substrate “EOMIN(TM)”[PDF/208KB]

2014.08.28

Financial Results for the 1st Quarter

2014.08.28

Earnings Release Conference for the 1st Quarter

2014.08.28

TAIYO YUDEN Revises Forecasts of Results

2014.08.26

TAIYO YUDEN Presents a Lineup of Three Bluetooth® Smart Modules[PDF/363KB]

2014.07.31

TAIYO YUDEN Announces the Release of the 2014 Safety & Environmental Report[PDF/227KB]

2014.07.30

A component library for CR-5000 Lightning has been updated.

2014.07.29

TAIYO YUDEN Facilitates the Efficient Operation of Mega Solar Power Plants with a Wireless Monitoring System[PDF/428KB]

2014.07.03

Component Libraries for ADS, ANSYS Designer, Microwave Office Simulators have been updated.

2014.06.30

Voting Count Results

2014.06.24

TAIYO YUDEN Expands Its Lineup of the EIA 01005 Size High Frequency Multilayer High-Q Chip Inductor[PDF/476KB]

2014.06.03

Notice of convocation of the 73rd ordinary general meeting of shareholders

2014.06.03

Financial Summary FY2005~FY2014

2014.05.27

Consolidated Financial Results for the Year Ended March 31, 2014 and Future Management Policies

2014.05.27

Earnings Release Conference

2014.05.27

Financial Results

2014.05.15

TAIYO YUDEN Expands Its Lineup of the Metal Power Inductor MCOIL(TM)[PDF/495KB]

2014.04.17

TAIYO YUDEN Plans to Start the Production of the 008004 Size Multilayer Ceramic Capacitor within the Calendar Year[PDF/709KB]

2014.04.14

“Taiyo Yuden Components Selection Guide & Data Library”, “S-parameter”, “SPICE model” and “Simulator for EMC Components” have been updated.(Design Support Tools)

2014.04.10

TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/336KB]

2014.04.09

TAIYO YUDEN: Announces its Improved TY-COMPAS Website Component Data Viewer[PDF/429KB]

2014.03.31

TAIYO YUDEN Announces Personnel Change[PDF/300KB]

2014.03.19

TAIYO YUDEN Introduces the Thinnest Multilayer Ceramic Capacitor in the World having a Thickness of 0.11 mm[PDF/475KB]

2014.03.11

TAIYO YUDEN to Appear at electronica China 2014[PDF/373KB]

2014.02.19

Financial Results for the 3rd Quarter

2014.02.19

Earnings Release Conference for the 3rd Quarter

2014.02.19

TAIYO YUDEN Announces the Recognition of Non-operating Income Realized from the Gain on Foreign Exchange

2014.02.04

TAIYO YUDEN Starts the Commercialization of Multilayer Ceramic Capacitors with Metallic Frames[PDF/474KB]

2014.01.29

TAIYO YUDEN Starts the Commercialization of Multilayer Ceramic Capacitors that Utilize Resin External Electrodes[PDF/888KB]

2014.01.23

TAIYO YUDEN Introduces a New Type in the Embedded-Parts Multilayer Wiring Substrate “EOMIN(TM)”[PDF/355KB]

2014.01.16

TAIYO YUDEN Achieves a Capacitance of 0.22 μF in the 0.15 mm thick EIA 0201 Size Multilayer Ceramic Capacitor[PDF/457KB]

2013.12.19

TAIYO YUDEN Starts the Commercialization of World’s First Multilayer Metal Power Inductor[PDF/479KB]

2013.11.21

TAIYO YUDEN Donates to the Victims of Typhoon Haiyan in the Philippines[PDF/223KB]

2013.11.19

Financial Results for the 2nd Quarter

2013.11.19

Earnings Release Conference for the 2nd Quarter

2013.11.19

TAIYO YUDEN Announces the Reasons for Differences between Consolidated Forecasts and Actual Results, and Earnings Forecast Revisions

2013.10.29

TAIYO YUDEN Adds a New MB Series to its Metal Power Inductor MCOIL(TM)[PDF/464KB]

2013.10.25

TAIYO YUDEN to Appear at China High-Tech Fair ELEXCON2013[PDF/329KB]

2013.10.24

Annual Report 2013 (HTML)

2013.10.11

Financial Statements

2013.10.04

Annual Report 2013

2013.09.30

TAIYO YUDEN Announces Personnel Change[PDF/198KB]

2013.09.25

TAIYO YUDEN Expands Its Lineup of Small-size, High-capacity Multilayer Ceramic Capacitors and Highly Advanced Products[PDF/462KB]

2013.09.19

TAIYO YUDEN Announces the Commercialization of a 5mm Square Metal Power Inductor MCOIL(TM)[PDF/439KB]

2013.09.13

TAIYO YUDEN Simultaneously Establishes Two Business Locations at Chengdu and Xiamen in China[PDF/332KB]

2013.09.12

TAIYO YUDEN Achieves the World’s First 330μF Multilayer Ceramic Capacitor[PDF/467KB]

2013.09.10

TAIYO YUDEN to Appear at CEATEC 2013[PDF/353KB]

2013.09.05

TAIYO YUDEN Develops Automotive Metal Power Inductors MCOIL(TM)[PDF/457KB]

2013.08.23

Earnings Release Conference for the 1st Quarter

2013.08.23

Financial Results for the 1st Quarter

2013.08.23

TAIYO YUDEN Announces the Recognition of Non-operating Income (Gain on Foreign Exchange)

2013.08.05

TAIYO YUDEN Consolidates Its Electronic Components and Complex Devices Range to Meet Market Needs for High Reliability Applications[PDF/383KB]

2013.07.30

TAIYO YUDEN Mobile Technology Co., Ltd., Establishment of a New Factory[PDF/398KB]

2013.07.30

TAIYO YUDEN Announces the Release of the 2013 Safety & Environmental Report[PDF/226KB]

2013.06.20

TAIYO YUDEN Announces Notification Regarding its Forecast of Extraordinary Losses Accompanying Structural Reforms at a Subsidiary Company

2013.06.03

Notice of convocation of the 72nd ordinary general meeting of shareholders

2013.05.31

Consolidated Financial Results for the Year Ended March 31, 2013 and Future Management Policies

2013.05.31

Earnings Release Conference

2013.05.31

Financial Results

2013.05.31

TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results from Operations

2013.05.31

TAIYO YUDEN Announces the Recognition of Non-operating Income Realized from the Gain on Foreign Exchange

2013.05.31

TAIYO YUDEN Announces Changes in its Representative Directors and Directors

2013.05.31

Financial Summary FY2004~FY2013

2013.05.16

TAIYO YUDEN Announces the Commercial Production of a 150μF Multilayer Ceramic Capacitor[PDF/452KB]

2013.05.15

“Simulator for EMC Components” has been updated. (Design Support Tools)

2013.04.22

TAIYO YUDEN Announces the Commercial Production of a Cylinder Type Lithium Ion Capacitor with a 270F Capacitance

2013.04.18

Taiyo Yuden Components Selection Guide & Data Library, S-parameter and SPICE model have been updated. (Design Support Tools)

2013.04.03

TAIYO YUDEN Announces Extraordinary Activities:1. Gain reported as the result of the Transfer of a Subsidiary Company's Fixed Assets 2. The Incurrence of an Extraordinary Loss accompanying a TAIYO YUDEN Settlement Package

2013.03.12

TAIYO YUDEN Announces Structural Reorganization and Personnel Change[PDF/346KB]

2013.03.04

TAIYO YUDEN to Appear at the Electronica China 2013[PDF/374KB]

2013.02.19

Earnings Release Conference for the 3rd Quarter

2013.02.19

Financial Results for the 3rd Quarter

2013.02.19

TAIYO YUDEN Revises Forecasts of Results

2013.02.19

TAIYO YUDEN Announces the Recognition of Non-operating Income associated with the Gain on Foreign Exchange

2013.01.15

Renewal of the “Simulator for EMC Compornents” in the Product Information

2012.12.17

TAIYO YUDEN Announces New Low Profile Enhancements to its Metal Power Inductors MCOIL(TM) Product Line-up

2012.12.03

New topics added to the “Technical Presentations”.

2012.11.16

Earnings Release Conference for the 2nd Quarter

2012.11.16

Financial Results for the 2nd Quarter

2012.11.16

TAIYO YUDEN Announces the Reasons for Discrepancies between Consolidated Forecast and Actual Results, and Earnings Forecast Revisions

2012.11.01

TAIYO YUDEN Announces an EIA 0603 Size Chip Bead Inductor with the Highest Current Rating in the Industry[PDF/483KB]

2012.10.18

TAIYO YUDEN to Appear at the China High-Tech Fair ELEXCON 2012[PDF/348KB]

2012.10.17

TAIYO YUDEN Announces the Establishment of the TAIYO YUDEN Web Store in conjunction with Chip One Stop[PDF/126KB]

2012.09.25

TAIYO YUDEN Announces the Commercial Release of its EIA 0201 Size Multilayer Ceramic Capacitor with a 2.2μF Capacitance[PDF/641KB]

2012.09.21

Annual Report 2012 (PDF)

2012.09.21

Annual Report 2012 (HTML)

2012.09.13

TAIYO YUDEN to Appear at CEATEC 2012[PDF/460KB]

2012.09.13

TAIYO YUDEN Announces Cylinder Type Lithium Ion Capacitor Capable of Operating up to 85ºC[PDF/538KB]

2012.09.12

TAIYO YUDEN Announces Personnel Change[PDF/203KB]

2012.08.28

TAIYO YUDEN Announces the Commercial Production of a High Temperature Cylinder Type Polyacene Capacitor Guaranteed to Operate up to 70ºC[PDF/524KB]

2012.08.23

TAIYO YUDEN Announces the EIA 01005 Size High Frequency Multilayer Ceramic Capacitor with a Rated Voltage of 25V[PDF/628KB]

2012.08.23

TAIYO YUDEN Announces the EIA 01005 Size High Frequency Multilayer High-Q Chip Inductor[PDF/462KB]

2012.08.23

Earnings Release Conference for the 1st Quarter

2012.08.23

Financial Results for the 1st Quarter

2012.08.23

TAIYO YUDEN Announces the Recognition of Non-operating Expenses (Loss on Foreign Exchange)

2012.08.09

TAIYO YUDEN Announces the Release of the 2012 Safety & Environmental Report[PDF/368KB]

2012.07.31

TAIYO YUDEN Announces the Expanded Lineup of Multilayer Chip Bead Inductors for Smartphones[PDF/569KB]

2012.07.24

TAIYO YUDEN Annoueces Emphasizing Sales in a High Growth Market through Proposal–Based Business[PDF/245KB]

2012.07.23

TAIYO YUDEN Announces the Commercialization of a 4mm Square Metal Power Inductor “MCOILTM”[PDF/460KB]

2012.07.23

TAIYO YUDEN Announces the Commercial Release of High Frequency Multilayer High Q Chip Inductor with Industry Best Q-Value[PDF/434KB]

2012.07.06

The topic of “High Frequency Products” is added to the Technical Presentations.

2012.06.11

TAIYO YUDEN Announces an EIA 0603 size Multilayer Ceramic Capacitor with a 47μF Capacitance[PDF/467KB]

2012.06.06

Financial Summary FY2003~Y2012

2012.06.06

Notice of convocation of the 71st ordinary general meeting of shareholders

2012.05.29

Presentation Data of New Medium-term Management Plan

2012.05.29

Presentation Data of Earnings Release Conference

2012.05.29

Financial Results

2012.05.10

TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]

2012.04.27

TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors

2012.04.23

“EOMIN” and “SAW devices” are added to the technical presentations page.

2012.04.16

TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]

2012.04.12

TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/201KB]

2012.04.11

TAIYO YUDEN Announces Personnel Change[PDF/213KB]

2012.04.02

TAIYO YUDEN Announces Posting of Extraordinary Losses Associated with the Results of Solicitation for Voluntary Retirement and Business Restructuring in Domestic and Overseas Subsidiaries

2012.03.30

Notice of the Early Redemption at the Option of the Bond Holders

2012.03.29

TAIYO YUDEN Announces Personnel Change[PDF/212KB]

2012.03.21

TAIYO YUDEN will participate in China International Inport Expo.

2012.03.06

TAIYO YUDEN Announces the Results of Solicitation for Voluntary Retirement

2012.02.21

Presentation Data of Earnings Release Conference for the 3rd Quarter

2012.02.21

Financial Results for the 3rd Quarter

2011.12.26

TAIYO YUDEN Announces an Earnings Forecast Revision along with an Expected Extraordinary Loss from Soliciting Employees for Voluntary Retirement

2011.12.20

TAIYO YUDEN: Two Domestic Group Companies Acquire the OHSAS18001 Certification[PDF/231KB]

2011.11.18

Presentation Data of Earnings Release Conference for the 2nd Quarter

2011.11.18

Forecast of Consolidated Performance and Measures to Improve Profitability

2011.11.18

Financial Results for the 2nd Quarter

2011.11.18

Revised Dividends and Dividends Forecast

2011.11.18

The Reasons for Discrepancies between Consolidated Forecast and Actual Results, Earnings Forecast Revisions, and Reversal

2011.10.18

TAIYO YUDEN to Appear at China High-Tech Fair ELEXCON 2011 [Acrobat PDF458KB]

2011.10.18

TAIYO YUDEN will participate in ELEXCON 2011.

2011.09.29

TAIYO YUDEN: Notice of Website Renewal TAIYO YUDEN Updates its WebsiteDesign while Upgrading and Expanding Product as wellas IR Information through a Full-Scale Renewal[Acrobat PDF482KB]

2011.09.29

Update of “TAIYO YUDEN: Notice of Website Renewal” in “Press Release”.

2011.09.26

Update of “TAIYO YUDEN Begins Provision of Web-based Component Data Viewer “TY-COMPAS”” in “Press Release”.

2011.09.26

TAIYO YUDEN Begins Provision of Web-based Component Data Viewer “TY-COMPAS” Simple and Easy to Use Search and Browsing of the Latest Electronic Component Data-[Acrobat PDF284KB]

2011.09.13

TAIYO YUDEN will participate in KES 2011.

2011.09.13

TAIYO YUDEN to Appear at KES-Korea Electronics Show 2011-[Acrobat PDF324KB]

2011.09.13

Update of “Thin-Type Polyacene Capacitor Developed for Improved Rated Voltage and Reliability” in “Press Release”.

2011.09.13

TAIYO YUDEN: Thin-Type Polyacene Capacitor Developed for Improved RatedVoltage and Reliability Developed for Smartphone’s LED Flash and SSD’s Uninterruptible Power Source Applications-[Acrobat PDF344KB]

2011.09.08

Update of “TAIYO YUDEN Announces the World’s First Practicable Circuit Board Embedding of Gallium Arsenide Semiconductors” in “Press Release”.

2011.09.08

TAIYO YUDEN Announces the World’s First Practicable Circuit Board Embedding of Gallium Arsenide Semiconductors – Further Application of the Embedded-parts Multilayer Wiring Substrate “EOMIN®” in Communication Modules-[Acrobat PDF357KB]

2011.09.07

Annual Report 2011

2011.09.06

TAIYO YUDEN to Appear at CEATEC JAPAN 2011[PDF/345KB]

2011.09.06

TAIYO YUDEN will participate in CEATEC JAPAN 2011.

2011.08.22

TAIYO YUDEN Releases the English Version of its 2011 Safety & Environmental Report A Report on Safety and Environmental Efforts in FY2010 and New Medium-Term Environmental Targets[PDF/151KB]

2011.08.22

Update of ”Safety & Environmental Report 2011” in ”Corporate Information”

2011.08.10

Announcement Of New Manufacturing Site By Subsidiary[PDF/102KB]

2011.08.10

Update of “Announcement Of New Manufacturing Site By Subsidiary” in “Press Release”.

2011.08.05

TAIYO YUDEN Revises Forecasts of Results[PDF/279KB]

2011.08.05

Announcement of Financial Results for the 1st Quarter of FY2012.

2011.08.05

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2011.08.05

Financial Results for the 1st Quarter

2011.08.05

Presentation Data of Earnings Release Conference for the 1st Quarter

2011.07.29

“Component Library” data in “Design Support Tools” section were updated.

2011.07.28

Financial Summary FY2002~Y2011

2011.06.30

TAIYO YUDEN Announces Structural Reorganization[PDF/262KB]

2011.06.30

Update of “TAIYO YUDEN Announces Structural Reorganization” in “Press Release”.

2011.06.30

TAIYO YUDEN Announces Commercialization of the World’s First Multilayer Ceramic Capacitor with a Capacitance of 220µF High Value Multilayer Ceramic Capacitor Series Lineup Expansion[PDF/361KB]

2011.06.30

Update of “TAIYO YUDEN Announces Commercialization of the World’s First Multilayer Ceramic Capacitor with a Capacitance of 220µF” in “Press Release”.

2011.06.29

Financial Statements

2011.06.10

Update of “Notice of convocation of the 70th ordinary general meeting of shareholders” in “General Meeting of Shareholders”

2011.06.09

TAIYO YUDEN Announces Production Expansion of an Innovative Copper-core Embedded-parts Multilayer Wiring Substrate “EOMIN®” Full-scale Launch into the Embedded-parts Circuit Board Market for Smart Phones and Tablet PCs[PDF/440KB]

2011.06.09

Update of “TAIYO YUDEN Announces Production Expansion of an Innovative Copper-core Embedded-parts Multilayer Wiring Substrate “EOMIN®”” in “Press Release”.

2011.06.08

Notice of convocation of the 70th ordinary general meeting of shareholders

2011.05.24

TAIYO YUDEN Announces the Commercial Release of Low-Profile Power Inductor with Industry’s Best-in-Class DC Bias Characteristics 5mm-Square Power Inductor of 1mm Height, Optimum for Tablet PCs’ LCD Power Supply[PDF/291KB]

2011.05.24

Update of “TAIYO YUDEN Announces the Commercial Release of Low-Profile Power Inductor with Industry’s Best-in-Class DC Bias Characteristics” in “Press Release”.

2011.05.13

Presentation Data of Earnings Release Conference

2011.05.12

TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results[PDF/115KB]

2011.05.12

Announcement of Financial Results for the FY2011

2011.05.12

Update of “TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results” in “Press Release”.

2011.05.12

Financial Results

2011.05.09

TAIYO YUDEN Announces a Change in Its Representative Directors[PDF/334KB]

2011.05.09

Update of “TAIYO YUDEN Announces a Change in Its Representative Directors” in “Press Release”.

2011.05.09

TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors[PDF/322KB]

2011.05.09

Update of “TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors” in “Press Release”.

2011.04.27

Three of the data in “Design Support Tools” section (Taiyo Yuden Components Selection Guide & Data Library, S-parameter and SPICE model) were updated.

2011.04.22

Information regarding the damage situation of the Great East Japan Earthquake (The 9th report)

2011.04.20

TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award[PDF/77KB]

2011.04.20

Update of “TAIYO YUDEN CO., LTD. Receives Intel’s Preferred Quality Supplier Award” in “Press Release”.

2011.04.11

Information regarding the damage situation of the Great East Japan Earthquake (The 8th report)

2011.04.08

Information regarding the damage situation of the Great East Japan Earthquake and the influence of the planned outages (The 7th report)

2011.03.31

Information regarding the damage situation of the Tohoku district-off the Pacific Ocean Earthquake and the influence of the planned outages (The 6th report)

2011.03.24

Information regarding the damage situation of the Tohoku district-off the Pacific Ocean Earthquake and the influence of the planned outages (The 5th report)

2011.03.20

TAIYO YUDEN group donates for the victims of the Tohoku district – off the Pacific Ocean Earthquake

2011.03.18

Information regarding the damage situation of the Tohoku district – off the Pacific Ocean Earthquake and the influence of the planned outages (The 4th report)

2011.03.14

Notification: Our website becomes temporarily unavailable due to the planned outages.

2011.03.14

Information regarding the damage situation of the Tohoku district – off the Pacific Ocean Earthquake (The 3rd report)

2011.03.13

Information regarding the damage situation of the Tohoku district – off the Pacific Ocean Earthquake (The 2nd report)

2011.03.12

Information regarding the damage situation of the Tohoku district – off the Pacific Ocean Earthquake

2011.02.08

Announcement of Financial Results for the 3rd Quarter of FY2011.

2011.02.08

Presentation Data of Earnings Release Conference for the 3rd Quarter

2011.02.08

Financial Results for the 3rd Quarter

2011.02.04

Notification: Website Temporarily Closed.

2011.01.18

TAIYO YUDEN Announces Lineup Expansion of EIA 01005 Size Multilayer Ferrite Chip Beads for Noise Reduction Responding to the Need for Further Compactness in Increasingly Advanced and High-Performance Smart Phones[PDF/327KB]

2011.01.18

Update of “TAIYO YUDEN Announces Lineup Expansion of EIA 01005 Size Multilayer Ferrite Chip Beads for Noise Reduction” in “Press Release”.

2010.11.05

TAIYO YUDEN Revises Forecasts of Results[PDF/261KB]

2010.11.05

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2010.11.05

Announcement of Financial Results for the 2nd Quarter of FY2011.

2010.11.05

Presentation Data of Earnings Release Conference for the 2nd Quarter

2010.11.05

Financial Results for the 2nd Quarter

2010.10.07

Four of the data in “Design Support Tools” section (S-parameter; SPICE model; TAIYO YUDEN Simulator and Taiyo Yuden Components Selection Guide & Data Library)were updated.

2010.10.04

TAIYO YUDEN Develops Wireless Module for “TransferJet™” High-Speed Wireless Transfer Technology Half-Mini Card Size Enables Easy Implementation of TransferJet™ Support in Notebook Computers[PDF/246KB]

2010.10.04

Update of “TAIYO YUDEN Develops Wireless Module for “TransferJet™” High-Speed Wireless Transfer Technology” in “Press Release”.

2010.10.01

TAIYO YUDEN Announces the Successful Development of a Duplexer with Zero Frequency Fluctuation with Temperature Development Aimed at the 3rd to 3.9th Generation Mobile Phone 1.8 GHz-Band Communication Systems Such As the W-CDMA BAND III[PDF/307KB]

2010.10.01

Update of “TAIYO YUDEN Announces the Successful Development of a Duplexer with Zero Frequency Fluctuation with Temperature” in “Press Release”.

2010.09.27

TAIYO YUDEN Announces Details of an Extraordinary Loss due to Structural Reforms Implemented in the Company’s Optical Media Products Business While Revising Its Forecasts of Results[PDF/300KB]

2010.09.27

Update of “TAIYO YUDEN Announces Details of an Extraordinary Loss due to Structural Reforms Implemented in the Company’s Optical Media Products Business While Revising Its Forecasts of Results” in “Press Release”.

2010.09.21

TAIYO YUDEN Announces the Commercial Release of Power Inductors thatAchieve Industry-Leading DC Bias Characteristics DC Resistance and DC Bias Characteristics Substantially Improved Compared with Existing Products[PDF/343KB]

2010.09.21

Update of “TAIYO YUDEN Announces the Commercial Release of a Power Inductor that Helps to Realize More Compact and Energy Efficient Mobile Devices” in “Press Release”.

2010.09.21

Update of “TAIYO YUDEN Announces the Commercial Release of Power Inductors thatAchieve Industry-Leading DC Bias Characteristics” in “Press Release”.

2010.09.21

TAIYO YUDEN Announces the Commercial Release of a Power Inductor that Helps to Realize More Compact and Energy Efficient Mobile Devices Improving DC Resistance and High Frequency Characteristics to Enhance DC-DC Converter Efficiency[PDF/316KB]

2010.09.17

TAIYO YUDEN will participate in CEATEC 2010.

2010.09.15

TAIYO YUDEN Announces the Commercial Release of a Backlight Driver Module for Use in LED TVs Compatible with a Variety of Functions Including 3D-Image Mode and Local Dimming[PDF/274KB]

2010.09.15

Update of “TAIYO YUDEN Announces the Commercial Release of a Backlight Driver Module for Use in LED TVs” in “Press Release”.

2010.09.08

Update of “Annual Report 2010″ in “IR Library”.

2010.09.07

TAIYO YUDEN Presents a Solution to Multilayer Ceramic Capacitor Audible Ringing Problem Rated for Same 10 µF Capacitance, New Capacitors Reduce Physical Distortion to One Half Compared to Predecessor Products[PDF/330KB]

2010.09.07

Update of “TAIYO YUDEN Presents a Solution to Multilayer Ceramic Capacitor Audible Ringing Problem” in “Press Release”.

2010.09.06

Annual Report 2010

2010.08.31

Update of ”Safety & Environmental Report 2010” in ”Corporate Information”

2010.08.23

TAIYO YUDEN Announces the Commercial Release of LW Reversal Decoupling Capacitors Achieves Industry-Leading Capacitance Value of 22µF Realizing High Capacitance Utilizing Advanced Material and Thin Layer Technologies[PDF/393KB]

2010.08.23

Update of “TAIYO YUDEN Announces the Commercial Release of LW Reversal Decoupling Capacitors Achieves Industry-Leading Capacitance Value of 22µF” in “Press Release”.

2010.08.04

TAIYO YUDEN Revises Forecasts of Results[PDF/265KB]

2010.08.04

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2010.08.04

Presentation Data of Earnings Release Conference for the 1st Quarter

2010.08.04

Financial Results for the 1st Quarter

2010.08.03

TAIYO YUDEN Announces the Commercial Release of a Low Profile PAS Capacitor for LED Flash Used in Compact Mobile Devices Bolstering Initiatives Aimed at the Energy Device Market, which is Expected to Experience Growth[PDF/307KB]

2010.08.03

Update of “TAIYO YUDEN Announces the Commercial Release of a Low Profile PAS Capacitor for LED Flash Used in Compact Mobile Devices” in “Press Release”.

2010.07.29

TAIYO YUDEN Announces Personnel Change[PDF/114KB]

2010.07.29

Update of “TAIYO YUDEN Introduces a New Multilayer Chip Power Inductor Approximately 72% Smaller than the Company’s Previous Products” in “Press Release”.

2010.07.29

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010.07.29

TAIYO YUDEN Introduces a New Multilayer Chip Power Inductor Approximately 72% Smaller than the Company’s Previous Products Combining a High Current Rating with Low DC Resistance in an EIA 0603 Size that is 0.55 mm Thin[PDF/294KB]

2010.07.26

TAIYO YUDEN Announces Commercial Release of EIA 0805 Size Multilayer Diplexer for Cellular Band Applications Optimized for Send/Receive Systems of Progressively More Multi-Band Mobile Phones[PDF/299KB]

2010.07.26

Update of “TAIYO YUDEN Announces Commercial Release of EIA 0805 Size Multilayer Diplexer for Cellular Band Applications” in “Press Release”.

2010.07.14

TAIYO YUDEN Announces Commercial Release of Multilayer Dual Low Pass Filter, Industry’s Smallest in its Class EIA 0603 Size with the Height of Just 0.45mm Contributes to Compact Smartphones[PDF/223KB]

2010.07.14

Update of “TAIYO YUDEN Announces Commercial Release of Multilayer Dual Low Pass Filter, Industry’s Smallest in its Class” in “Press Release”.

2010.07.01

TAIYO YUDEN Announces Personnel Change[PDF/341KB]

2010.07.01

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010.06.30

Financial Statements

2010.06.15

A new topic, “Power Inductors Ver.2″ was added to the Web Seminar section in the Support & Downloads.

2010.06.08

Notice of convocation of the 69th ordinary general meeting of shareholders

2010.05.18

TAIYO YUDEN Achieves an Industry-Leading Thinness of 0.7 mm through Its EIA 0603 Size Wire-Wound Power Inductor Expanding its Lineup for Compact Mobile Devices while Combining Size and Height Reductions with Lower DC Resistance[PDF/299KB]

2010.05.18

Update of “TAIYO YUDEN Achieves an Industry-Leading Thinness of 0.7 mm through Its EIA 0603 Size Wire-Wound Power Inductor” in “Press Release”.

2010.05.14

Presentation Data of Earnings Release Conference

2010.05.13

TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors[PDF/177KB]

2010.05.13

Update of “TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results” in “Press Release”.

2010.05.13

Update of “TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors” in “Press Release”.

2010.05.13

Announcement of Financial Results for the FY2010

2010.05.13

TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results[PDF/135KB]

2010.05.13

Financial Results

2010.05.07

“Taiyo Yuden Components Selection Guide & Data Library” was newly added to the web seminar section in the Support and Downloads.

2010.04.28

Five of the data in “Support & Downloads” section (S-parameter; SPICE model; Component Library; TAIYO YUDEN Simulator and Taiyo Yuden Components Selection Guide & Data Library) were updated .

2010.04.26

TAIYO YUDEN’s 0.22mm-Thin Multilayer Ceramic Capacitor Achieves Industry-Leading Capacitance Value of 1µF 0.47µF Capacitance even in a 0.15mm Profile Enables Mounting for Component-Embedded Substrates[PDF/385KB]

2010.04.26

Update of “TAIYO YUDEN’s 0.22mm-Thin Multilayer Ceramic Capacitor Achieves Industry-Leading Capacitance Value of 1µF” in “Press Release”.

2010.04.20

TAIYO YUDEN Introduces the World’s First 0.1µF EIA 01005 Size Multilayer Ceramic Capacitor Uses Advanced Materials and Thin Layer Technologies to Achieve High Capacitance in an Ultra Compact Size[PDF/357KB]

2010.04.20

Update of “TAIYO YUDEN Introduces the World’s First 0.1µF EIA 01005 Size Multilayer Ceramic Capacitor” in “Press Release”.

2010.04.01

New categories,”SAW/FBAR devices”and”Frontend Modules”are added to the products lineup.

2010.04.01

New products categories,”SAW/FBAR devices”and “Frontend Modules”are added. They are for mobile communication equipment.

2010.03.31

TAIYO YUDEN Announces Personnel Change[PDF/121KB]

2010.03.31

Update of “TAIYO YUDEN Completes Steps to Acquire the Communications Device Business of Fujitsu Media Devices, Making it Subsidiary Company” in “Press Release”.

2010.03.31

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010.03.31

TAIYO YUDEN Completes Steps to Acquire the Communications Device Business of Fujitsu Media Devices, Making it Subsidiary Company[PDF/217KB]

2010.03.25

TAIYO YUDEN Announces Personnel Change[PDF/100KB]

2010.03.25

Update of “TAIYO YUDEN Introduces World’s First 100µF in EIA 0805 Size Multilayer Ceramic Capacitor” in “Press Release”.

2010.03.25

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010.03.25

TAIYO YUDEN Introduces World’s First 100µF in EIA 0805 Size Multilayer Ceramic Capacitor Uses Advanced Materials Technology and Thin Layer Technology to Achieve Reduction by about 62% of the Company’s Previous Product Size [PDF/352KB]

2010.02.22

Discontinuation of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures)[PDF/106KB]

2010.02.22

Update of “Discontinuation of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures)” in “Press Release”.

2010.02.12

Notification: Website Temporarily Closed.

2010.02.09

TAIYO YUDEN Revises Forecasts of Results[PDF/148KB]

2010.02.09

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2010.02.09

Announcement of Financial Results for the 3rd Quarter of FY2010.

2010.02.09

Presentation Data of Earnings Release Conference for the 3rd Quarter

2010.02.09

Financial Results for the 3rd Quarter

2010.02.02

“Taiyo Yuden Components Selection Guide & Data Library” on the Support & Download page was updated in search and display functions

2010.01.19

TAIYO YUDEN Introduces Two Additional Compact and Low Profile Power Inductors for Mobile Devices Maintaining Industry-Leading DC Bias Characteristics with an Approximate 17% Reduction in Size and Thickness[PDF/343KB]

2010.01.19

Update of “TAIYO YUDEN Introduces Two Additional Compact and Low Profile Power Inductors for Mobile Devices” in “Press Releases”.

2010.01.06

TAIYO YUDEN Introduces the Low ESL Capacitor Featuring an Industry-High Capacitance of 1µF with 0.3mm Thickness An LW Reversal Decoupling Capacitor Thickness Reduced by 40% Compared with Existing TAIYO YUDEN Products[PDF/353KB]

2010.01.06

Update of “TAIYO YUDEN Introduces the Low ESL Capacitor Featuring an Industry-High Capacitance of 1µF with 0.3mm Thickness” in “Press Releases”.

2009.12.17

TAIYO YUDEN to Acquire the Communications Device Business of Fujitsu Media Devices, Making it a Subsidiary Company[PDF/150KB]

2009.12.17

Update of “TAIYO YUDEN to Acquire the Communications Device Business of Fujitsu Media Devices, Making it a Subsidiary Company” in “Press Releases”.

2009.11.09

TAIYO YUDEN Navigator (Technical Journal) Vol.3″ was added to the support&downloads.

2009.11.06

TAIYO YUDEN Revises Forecasts of Results[PDF/291KB]

2009.11.06

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2009.11.06

Announcement of Financial Results for the 2nd Quarter of FY2010.

2009.11.06

Presentation Data of Earnings Release Conference for the 2nd Quarter

2009.11.06

Financial Results for the 2nd Quarter

2009.10.19

“EOMIN (Embedded Organic Module Involved Nanotechnology)”was added to Web Seminar contents in the Support & Downloads page.

2009.10.06

Five of the data in “Support & Downloads” section (S-parameter; SPICE model; Component Library; TAIYO YUDEN Simulator and Taiyo Yuden Components Selection Guide & Data Library) were updated .

2009.10.06

Our new general catalog in 2010 was updated.

2009.10.01

TAIYO YUDEN Introduces EIA 0402 0.22µF Low-Profile Multilayer Ceramic Capacitor 0.15mm Profile Enables Even Higher Density Surface Mounting for Smaller Mobile Devices[PDF/349KB]

2009.10.01

Update of “TAIYO YUDEN Introduces EIA 0402 0.22µF Low-Profile Multilayer Ceramic Capacitor” in “Press Releases”.

2009.09.30

TAIYO YUDEN Introduces EIA 0201 Multilayer Chip Varistors with High ESD Tolerance Ideal for Electrostatic Discharge Protection in Hand-Held Mobile Devices[PDF/251KB]

2009.09.30

Update of “TAIYO YUDEN Introduces EIA 0201 Multilayer Chip Varistors with High ESD Tolerance” in “Press Releases”.

2009.09.29

TAIYO YUDEN Introduces EIA 0201 1µF Multilayer Ceramic Capacitor Achieving Industry-Leading High Capacitance in a Smaller Size[PDF/327KB]

2009.09.29

Update of “TAIYO YUDEN Introduces EIA 0201 1µF Multilayer Ceramic Capacitor” in “Press Releases”.

2009.09.28

TAIYO YUDEN to Acquire the Communications Device Business of Fujitsu Media Devices[PDF/204KB]

2009.09.28

Update of “TAIYO YUDEN to Acquire the Communications Device Business of Fujitsu Media Devices” in “Press Releases”.

2009.09.15

TAIYO YUDEN Introduces Industry’s Smallest GPS Antenna EIA 1206 Size, 0.5mm Thick;87% Smaller Volume, 69% Lower Profile[PDF/249KB]

2009.09.15

Update of “TAIYO YUDEN Introduces Industry’s Smallest GPS Antenna” in “Press Releases”.

2009.09.07

TAIYO YUDEN Announces Personnel Change[PDF/101KB]

2009.09.07

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2009.09.01

Update of “Annual Report 2009″ in “IR Library”.

2009.09.01

Annual Report 2009

2009.08.28

Update of ”Safety & Environmental Report 2009” in ”Corporate Information”.

2009.08.24

BRC2518 series is added to inductor section of product information.

2009.08.24

BRC2518 series is added to the product line. It is a 2518(1007) sized compact power inductor that is an excellent component to use in DC-DC converters of HDDs, DVCs or DSC.

2009.08.17

NR5040 series is added to inductor section of product information.

2009.08.17

NR5040 series is added to the product line. It is an optimum 5mm square sized compact power inductor to be used for DC-DC converters in FPDs or Blue-ray disc recorders for its excellent DC bias characteristics.

2009.08.07

“ TAIYO YUDEN’s antenna and filter products” was added to Web Seminar contents in the Support & Downloads page.

2009.08.07

NRV3012 series is added to inductor section of product information.

2009.08.07

NRV3012 series is added to the product line, which is designed to be used for DC-DC converters in LED flash. It is a 3mm square sized small and low-profile power inductors with good DC bias characteristic.

2009.08.06

TAIYO YUDEN Revises Forecasts of Results.[PDF/81KB]

2009.08.06

Announcement of Financial Results for the 1st Quarter of FY2010.

2009.08.06

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2009.08.06

Presentation Data of Earnings Release Conference for the 1st Quarter

2009.08.06

Financial Results for the 1st Quarter

2009.08.03

NRH3010, NRH3012 series are added to inductor section of product information.

2009.08.03

NRH3010 and NRH3012 series are added to our product line, small and low-profile power inductors that come in 3mm square size. They are designed to be better than conventional ones in DC bias characteristics and suited to be used for DC-DC converters in cellular phones or LCDs.

2009.07.16

TAIYO YUDEN Introduces New, Low-Profile Power Inductors with Industry-Leading DC Bias Characteristics Sizes 6010 and 5012 Added to “NR” Lineup of Wire-Wound Inductors[PDF/316KB]

2009.07.16

Update of “TAIYO YUDEN Introduces New, Low-Profile Power Inductors with Industry-Leading DC Bias Characteristics” in “Press Release”.

2009.07.09

TAIYO YUDEN Announces Personnel Change[PDF/229KB]

2009.07.09

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2009.07.09

Update of “TAIYO YUDEN Introduces Low-Profile Multilayer Ceramic Capacitors, Essential for Slimmer Cell Phones” in “Press Releases”.

2009.07.09

TAIYO YUDEN Introduces Low-Profile Multilayer Ceramic Capacitors, Essential for Slimmer Cell Phones Industry-Leading Capacitance of 0.47µF in EIA 0402 Case Size with 0.22 mm Height[PDF/548KB]

2009.07.07

TAIYO YUDEN Introduces Industry-First Common Mode Choke Coil with 10 GHz Cut Off Frequency 25% Higher Cut Off Frequency, Ideal for USB 3.0 Applications[PDF/303KB]

2009.07.07

Update of “TAIYO YUDEN Introduces Industry-First Common Mode Choke Coil with 10 GHz Cut Off Frequency” in “Press Releases”.

2009.07.02

We upgraded the function to search our web contents.

2009.06.29

TAIYO YUDEN Announces Personnel Change[PDF/100KB]

2009.06.29

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2009.06.26

Financial Statements

2009.06.17

TAIYO YUDEN Achieves Industry-Leading DC Bias Characteristics in New 5mm Square Power Inductors Rated Current Improved By 25% And DC Resistance Improved By 20%[PDF/350KB]

2009.06.17

Update of “TAIYO YUDEN Achieves Industry-Leading DC Bias Characteristics in New 5mm Square Power Inductors ” in “Press Releases”.

2009.06.04

Notice of convocation of the 68th ordinary general meeting of shareholders

2009.05.14

Announcement of Financial Results for the FY2009

2009.05.14

Financial Results

2009.05.07

TAIYO YUDEN Introduces Groundbreaking Wire-Wound Power Inductor for LED Flash DC-DC Converters Delivers Industry-Leading DC Bias Characteristics in a Compact, Low-Profile Shape[PDF/330KB]

2009.05.07

Update of “TAIYO YUDEN Introduces Groundbreaking Wire-Wound Power Inductor for LED Flash DC-DC Converters” in “Press Releases”.

2009.04.27

TAIYO YUDEN Announces Personnel Change[PDF/90KB]

2009.04.27

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2009.04.27

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Releases”.

2009.04.27

TAIYO YUDEN Revises Forecasts of Results[PDF/110KB]

2009.04.15

Five of the data in “Support & Downloads” section (S-parameter; SPICE model; Component Library; TAIYO YUDEN Simulator and Taiyo Yuden Components Selection Guide & Data Library) were updated .

2009.04.15

TAIYO YUDEN exhibits products in TECHINO-FRONTIER 2009(Wed, April 15-, Fri April 17,2009).

2009.03.31

Recording media page is updated.

2009.03.18

Technology Magazine「TAIYO YUDEN Navigator Vol.2」 is available on the Support & Download Page.

2009.01.23

Notification: Website Temporarily Closed.

2008.09.30

TAIYO YUDEN: Acquisition of Victor Advanced Media Co., Ltd. Stock (Inclusion in the Scope of Consolidation as a Subsidiary Company)[PDF/83KB]

2008.09.30

Publishing products in “Taiyo Yuden Components Selection Guide & Data Library” is updated. “Taiyo Yuden Components Selection Guide & Data Library” is available in Microsoft Windows VISTA.

2008.09.30

Update of “Acquisition of Victor Advanced Media Co., Ltd. Stock” in “Press Releases”.

2008.09.29

Updated the General Catalog to 2009 version.

2008.09.29

“S-parameter” and “SPICE model” in “Support & Downloads” is updated.

2008.09.29

Included in the General Catalog 2009.

2008.09.25

TAIYO YUDEN: Achieves Industry’s Thinnest 2.4GHz Chip Antenna, at 0.5mm —Contributes to More Compact, Thinner Mobile Phone, Further Spreading Wireless Connectivity Functions —[PDF/405KB]

2008.09.25

Korean version of TAIYO YUDEN web site published.

2008.09.25

Update of ” Achieves Industry’s Thinnest 2.4GHz Chip Antenna, at 0.5mm” in “Press Releases”.

2008.09.24

TAIYO YUDEN: Achieves Rated Current of 2.4A with EIA 1210 Size Power Inductor —Added High Current-Capable Part to Wire Wound Chip Inductor BR Series —[PDF/381KB]

2008.09.24

Update of ” Achieves Rated Current of 2.4A with EIA 1210 Size Power Inductor” in “Press Releases”.

2008.09.10

Update of “Annual Report 2008″ in “IR Library”.

2008.09.03

Update of ”Safety & Environmental Report 2008” in ”Corporate Information”.

2008.09.03

Annual Report 2008

2008.08.07

TAIYO YUDEN’s component Web seminar is available on the Support & Download Page.

2008.06.30

TAIYO YUDEN: Electronic Components Search and Viewer Function Eases Components Selection[PDF/310KB]

2008.06.30

Taiyo Yuden Components Selection Guide & Data Library is available in an English-language version on the TAIYO YUDEN web page, starting today.

2008.06.27

Financial Statements

2008.06.06

Update on TAIYO YUDEN’s support for recovery from the damage caused by the earthquake in China’s Sichuan Province.

2008.05.30

For server maintenance, our products search service will be temporary unavailable during the following period.( Local Time of Japan ) May 31st from 9:00 a.m. to 18:00 p.m. We apologize for your inconvenience.

2008.05.28

TAIYO YUDEN: Donation for Earthquake Recovery in China’s Sichuan Province[PDF/104KB]

2008.05.28

Update of “Donation for Earthquake Recovery in China’s Sichuan Province” in “Press Releases”.

2008.05.26

Commencement of Joint Venture Business through Acquisition of Stock[PDF/86KB]

2008.05.26

Update of “Commencement of Joint Venture Business through Acquisition of Stock” in “Press Releases”.

2008.05.23

Release the Support & Downloads” pages.”

2008.05.23

Release the Support & Downloads” pages.”

2008.05.14

Announcement of Financial Results for the FY2008

2008.04.15

TAIYO YUDEN: Launching EIA0201 Size Multilayer Chip Ferrite Beads for Power Circuits —Use of Advanced Multilayer and Printing Technologies Shrinks Chip Surface Area by 64%— [PDF/159KB]

2008.04.15

Update of “Launching EIA0201 Size Multilayer Chip Ferrite Beads for Power Circuits” in “Press Releases”.

2008.04.09

TAIYO YUDEN: More Variation in Wire Wound Power Inductors for Flat TVs —2.8mm Size Added to NR60 Series, for Lineup That Meets Market Needs —[PDF/410KB]

2008.04.09

Update of ” More Variation in Wire Wound Power Inductors for Flat TVs” in “Press Releases”.

2008.03.26

Partial Amendment to and Continuance of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures) [PDF/442KB]

2008.03.26

Update of ” Partial Amendment to and Continuance of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures)” in “Press Releases”.

2008.03.25

TAIYO YUDEN: Industry’s Smallest Wire-Wound Common Mode Choke Coil for HDMI Goes on Sale —Improved High Frequency Characteristics, Optimum for Common Mode Noise Countermeasures in High-Speed Interface—[PDF/327KB]

2008.03.25

Update of ” Industry’s Smallest Wire-Wound Common Mode Choke Coil for HDMI Goes on Sale” in “Press Releases”.

2008.03.03

TAIYO YUDEN Establishes a Regional Operational Headquarters and a Multilayer Ceramic Capacitor Manufacturing and Sales Subsidiary in Suzhou, China[PDF/271KB]

2008.03.03

Update of “TAIYO YUDEN Establishes a Regional Operational Headquarters and a Multilayer Ceramic Capacitor Manufacturing and Sales Subsidiary in Suzhou, China”in “Press Releases”.

2008.02.25

TAIYO YUDEN: Announcement of Dissolution of Subsidiary[PDF/109KB]

2008.02.25

Update of “Announcement of Dissolution of Subsidiary”in “Press Releases”.

2008.01.15

This Web service will be stopped during the following period.( Local Time of Japan ) January 20th from 8:00 a.m. to 6:00 p.m. February 10th from 8:00 a.m. to 6:00 p.m. We apologize for your inconvenience.

2007.11.07

Announcement of Financial Results for the 1st Half of FY2008

2007.11.01

Included in the General Catalog 2008.

2007.09.20

TAIYO YUDEN: Super Flexible Electromagnetic Wave Absorbing Film ‘EMSEAL SFX1′ Goes On Sale –Enables EMC and Noise Measures for Flexible PCBs–[PDF/308KB]

2007.09.20

Update of “Super Flexible Electromagnetic Wave Absorbing Film ‘EMSEAL SFX1′ Goes On Sale”in “Press Releases”.

2007.06.28

Financial Statements

2007.06.20

‘Global Network’ in ‘Corporate Information’ is updated.

2007.05.09

Announcement of Financial Results for the FY2007

2007.04.27

TAIYO YUDEN Announces Proposed Change in Accounting Auditor[PDF/82KB]

2007.04.27

Update of “TAIYO YUDEN Announces Proposed Change in Accounting Auditor” in “Press Releases”.

2007.04.26

Notice for imitation of TAIYO YUDEN products is added.

2007.04.16

‘Global Network’ in ‘Corporate Information’ is updated.

2007.04.05

TAIYO YUDEN Simulator is updated.

2007.03.26

TAIYO YUDEN: On the Introduction of Anti-Takeover Measures (outline)[PDF/231KB]

2007.03.26

Update of “On the Introduction of Anti-Takeover Measures (outline)” in “Press Releases”.

2007.03.22

TAIYO YUDEN: Announcing Sale of Compact Wire-Wound Power Inductor with High Current Capability for Mobile Devices — DC Bias Characteristics in 0805 Size Improves Performance by 27% Over Previous Model —[PDF/326KB]

2007.03.22

Update of “Announcing Sale of Compact Wire-Wound Power Inductor with High Current Capability for Mobile Devices”in “Press Releases”.

2007.03.08

Simulation Data/Library is updated.

2007.02.07

TAIYO YUDEN: Industry’s Smallest Wire Wound Inductor for LCD and Plasma TVs Reaches the Market — Expands NR Series Lineup, Achieves High-Current Capability of 3A in 6mm Square Case Size –[PDF/281KB]

2007.02.07

Notification: Website Temporarily Closed.

2007.02.07

Update of “Industry’s Smallest Wire Wound Inductor for LCD and Plasma TVs Reaches the Market” in “Press Releases”.

2007.02.02

TAIYO YUDEN to Acquire All Shares of Shoei Electronics[PDF/62KB]

2007.02.02

Update of “TAIYO YUDEN to Acquire All Shares of Shoei Electronics” in “Press Releases”.

2007.01.24

TAIYO YUDEN Announces Establishment of Subsidiary[PDF/104KB]

2007.01.24

Update of “TAIYO YUDEN Announces Establishment of Subsidiary” in “Press Releases”.

2007.01.16

Relaunch TAIYO YUDEN Website.

2007.01.16

Included in the General Catalog 2007.

2006.10.02

TAIYO YUDEN: Mass Production to Start for Compact High-Value Multilayer Ceramic Capacitors, the Industry’s Highest Capacitance Product —Achieves Capacitance of 4.7µF, an Industry First for EIA 0402 Case Size—[PDF/140KB]

2006.10.02

Update of Mass Production to Start for Compact High-Value Multilayer Ceramic Capacitors

2006.09.28

TAIYO YUDEN: Introducing the Compact, Low-Profile, High-Efficiency 1008-Size Multilayer Power Inductor —Rdc Reduced by 35% for DC-DC Converter Choke Coils—[PDF/173KB]

2006.09.28

Update of Introducing the Compact

2006.09.21

TAIYO YUDEN: High Frequency Inductor for Matching Circuits in Cell Phones and Other Devices —Optimization by Structural Characteristics Simulation Improves Q Factor by About 50%—[PDF/125KB]

2006.09.21

Update of “High Frequency Inductor for Matching Circuits in Cell Phones and Other Devices” in “Press Releases”.

2006.09.14

TAIYO YUDEN: Axial Lead Ceramic Capacitor Achieves 10µF, an Industry First – Merges High-Value Multilayer Ceramic Capacitor with Mass Production Technology for Leaded Components -[PDF/197KB]

2006.09.14

Update of Axial Lead Ceramic Capacitor Achieves 10µF

2006.09.07

TAIYO YUDEN: Announcing Sale of Compact Wire Wound Power Inductor, Optimum for Power Supplies of Mobile Equipment[PDF/140KB]

2006.09.07

Update of Sale of Compact Wire Wound Power Inductor

2006.06.29

‘Corporate Profile’ in ‘Corporate Information’ is updated.

2006.06.29

Financial Statements

2006.06.09

Some of the capacitors of 01005 size are added to ‘S-parameter’ and ‘the Component library for Ansoft Designer’ in Simulation.

2006.02.16

TAIYO YUDEN:BS7799 Certification Obtained for Philippine Production Site Information Security Management System Built to Boost Customer Trust[PDF/81KB]

2006.02.16

Update of “BS7799 Certification Obtained for Philippine Production Site Information Security Management System Built to Boost Customer Trust ” in “Press Releases”.

2006.02.10

‘Electric Components’ in ‘Product Information’ is updated.

2006.02.10

‘Electric Components’ in ‘Product Information’ is updated.

2006.02.07

TAIYO YUDEN: U.S. Power Supply Business Sold to Tamura Corporation ‘Choose and Concentrate’for Improved Operations Efficiency as Part of Plant Reorganization[PDF/114KB]

2006.02.07

Update of “U.S. Power Supply Business Sold to Tamura Corporation ‘Choose and Concentrate’ for Improved Operations Efficiency as Part of Plant Reorganization ” in “Press Releases”.

2006.02.02

Information about the Change of Representative Director[PDF/107KB]

2006.02.02

Update of “Information about the Change of Representative Director ” in “Press Releases”.

2006.01.23

Included in the General Catalog 2006.

2006.01.11

Kamaya Electric, KOA, Hokuriku Electrical Construction, and TAIYO YUDEN:Jointly Propose Recommended Dimensions for Chip Resistors, toward Spread of Bulk Mounting[PDF/126KB]

2005.12.08

TAIYO YUDEN:8mm Square Wire-Wound Power Inductor Achieves Rated Current of 3.4A, Highest[PDF/141KB]

2005.11.21

TAIYO YUDEN:Introducing the World’s Smallest GPS Ceramic Chip Antenna[PDF/107KB]

2005.11.15

TAIYO YUDEN: Announcing Mass Production of the Industry’s Thinnest 0.5mm Low Pass Filter for One-Segment Broadcasting[PDF/109KB]

2005.09.29

TAIYO YUDEN: Further Expansion of the Unit-Type Bulk Feeder Series[PDF/126KB]

2005.09.29

Murata, TDK, TAIYO YUDEN: Three Companies Jointly Propose New Recommended Dimensions for Ultra-Compact Multilayer Chip Ceramic Capacitors in the EIA 0201 Size, toward Spread of Environmentally Friendly Bulk Mounting [PDF/111KB]

2005.09.28

TAIYO YUDEN :Reverse-Geometry Multilayer Ceramic Capacitors in Smallest Size and Highest Capacitance[PDF/147KB]

2005.09.27

TAIYO YUDEN :1.2mm High Low-Profile Wire Wound Inductor Achieves Highest Rated Current in the Industry[PDF/120KB]

2005.09.26

TAIYO YUDEN :Comprehensive Sales Alliance Signed with U.S. Electronic Parts Manufacturer Kemet[PDF/106KB]

2005.09.21

TAIYO YUDEN :World’s Smallest Wire-Wound Chip Inductor for Power Circuits[PDF/120KB]

2005.09.20

TAIYO YUDEN :Industry’s Smallest 2.4GHz Balance Filter with Matching Circuit[PDF/129KB]

2005.09.15

TAIYO YUDEN :New Multilayer Choke Coil at Just 0.55mm, Thinnest in the Industry[PDF/130KB]

2005.08.05

MLCC’s information of AMK212BJ476MG, AMK316BJ107ML and JMK325BJ107MY are added.

2005.08.03

Information of Multilayer Chip Inductor for High Frequency HKQ Series(High Q type) is added.

2005.07.28

TAIYO YUDEN : Kankyo Assist Obtains ISO/IEC 17025 Accreditation for Analysis of Hazardous Substances[PDF/185KB]

2005.07.13

TAIYO YUDEN EMC Center: Launching Radio Regulation Testing and Certification Service in Europe and North America[PDF/172KB]

2005.06.30

TAIYO YUDEN : Mass Production of World’s First 100µF Multilayer Ceramic Capacitor in EIA1206 Size[PDF/116KB]

2005.06.29

HighQ type chip inductor(HKQ series) is added in Simulation.

2005.06.29

Financial Statements

2005.06.20

TAIYO YUDEN : Announcing World’s Smallest Wire Wound Chip Inductor for Signal Lines[PDF/136KB]

2005.06.09

TAIYO YUDEN : Triples Production Capacity for 0402-Size Multilayer Chip Varistors[PDF/134KB]

2005.04.13

TAIYO YUDEN : Introduction of New Wire Wound Power Inductor Product Completes Low Profile Lineup[PDF/250KB]

2005.03.24

TAIYO YUDEN : Launching 0.9mm Low Profile Multilayer Chip Inductor for Choke Coils[PDF/265KB]

2005.03.16

Environment Information is added on detailed spec page.

2005.03.10

TAIYO YUDEN : Introduces a New High-Q Product in the EIA0201 Multilayer Chip Inductor for High Frequency, Opening the Way to a Next-Generation Cell Phone That Redefines the Cell Phone[PDF/157KB]

2005.03.03

TAIYO YUDEN : Introduces Wound Chip Inductor Blending Low Rdc and High Current Characteristics in a Single Device[PDF/143KB]

2005.02.22

TAIYO YUDEN : TAIYO YUDEN EMC Center is Accredited Japan’s First ISO 17025 Certification for Radio Regulation Measurement —Demonstrated high quality measurement for Bluetooth® and radio regulationalong with obtained EMC standard—[PDF/86KB]

2005.02.15

Informations of AMK105BJ225MV and AMK107BJ106MA are added.

2005.01.11

Catalog PDF List is updated.

2004.06.29

Financial Statements

2003.06.27

Financial Statements

2002.06.27

Financial Statements