Latest Information news

2010. 11. 05

Press Releases

TAIYO YUDEN Revises Forecasts of Results[PDF/261KB]

2010. 08. 04

Press Releases

TAIYO YUDEN Revises Forecasts of Results[PDF/265KB]

2010. 07. 29

Press Releases

TAIYO YUDEN Announces Personnel Change[PDF/114KB]

2010. 07. 01

Press Releases

TAIYO YUDEN Announces Personnel Change[PDF/341KB]

2010. 05. 13

Press Releases

TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors[PDF/177KB]

2010. 05. 13

Press Releases

TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results[PDF/135KB]

2010. 03. 31

Press Releases

TAIYO YUDEN Announces Personnel Change[PDF/121KB]

2010. 03. 31

Press Releases

TAIYO YUDEN Completes Steps to Acquire the Communications Device Business of Fujitsu Media Devices, Making it Subsidiary Company[PDF/217KB]

2010. 03. 25

Press Releases

TAIYO YUDEN Announces Personnel Change[PDF/100KB]

2010. 02. 22

Press Releases

Discontinuation of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures)[PDF/106KB]

2010. 02. 09

Press Releases

TAIYO YUDEN Revises Forecasts of Results[PDF/148KB]

2010. 10. 04

Product

TAIYO YUDEN Develops Wireless Module for “TransferJet™” High-Speed Wireless Transfer Technology Half-Mini Card Size Enables Easy Implementation of TransferJet™ Support in Notebook Computers[PDF/246KB]

2010. 10. 01

Product

TAIYO YUDEN Announces the Successful Development of a Duplexer with Zero Frequency Fluctuation with Temperature Development Aimed at the 3rd to 3.9th Generation Mobile Phone 1.8 GHz-Band Communication Systems Such As the W-CDMA BAND III[PDF/307KB]

2010. 09. 27

Product

TAIYO YUDEN Announces Details of an Extraordinary Loss due to Structural Reforms Implemented in the Company’s Optical Media Products Business While Revising Its Forecasts of Results[PDF/300KB]

2010. 09. 21

Product

TAIYO YUDEN Announces the Commercial Release of Power Inductors thatAchieve Industry-Leading DC Bias Characteristics DC Resistance and DC Bias Characteristics Substantially Improved Compared with Existing Products[PDF/343KB]

2010. 09. 21

Product

TAIYO YUDEN Announces the Commercial Release of a Power Inductor that Helps to Realize More Compact and Energy Efficient Mobile Devices Improving DC Resistance and High Frequency Characteristics to Enhance DC-DC Converter Efficiency[PDF/316KB]

2010. 09. 15

Product

TAIYO YUDEN Announces the Commercial Release of a Backlight Driver Module for Use in LED TVs Compatible with a Variety of Functions Including 3D-Image Mode and Local Dimming[PDF/274KB]

2010. 09. 07

Product

TAIYO YUDEN Presents a Solution to Multilayer Ceramic Capacitor Audible Ringing Problem Rated for Same 10 µF Capacitance, New Capacitors Reduce Physical Distortion to One Half Compared to Predecessor Products[PDF/330KB]

2010. 08. 23

Product

TAIYO YUDEN Announces the Commercial Release of LW Reversal Decoupling Capacitors Achieves Industry-Leading Capacitance Value of 22µF Realizing High Capacitance Utilizing Advanced Material and Thin Layer Technologies[PDF/393KB]

2010. 08. 03

Product

TAIYO YUDEN Announces the Commercial Release of a Low Profile PAS Capacitor for LED Flash Used in Compact Mobile Devices Bolstering Initiatives Aimed at the Energy Device Market, which is Expected to Experience Growth[PDF/307KB]

2010. 07. 29

Product

TAIYO YUDEN Introduces a New Multilayer Chip Power Inductor Approximately 72% Smaller than the Company’s Previous Products Combining a High Current Rating with Low DC Resistance in an EIA 0603 Size that is 0.55 mm Thin[PDF/294KB]

2010. 07. 26

Product

TAIYO YUDEN Announces Commercial Release of EIA 0805 Size Multilayer Diplexer for Cellular Band Applications Optimized for Send/Receive Systems of Progressively More Multi-Band Mobile Phones[PDF/299KB]

2010. 07. 14

Product

TAIYO YUDEN Announces Commercial Release of Multilayer Dual Low Pass Filter, Industry’s Smallest in its Class EIA 0603 Size with the Height of Just 0.45mm Contributes to Compact Smartphones[PDF/223KB]

2010. 05. 18

Product

TAIYO YUDEN Achieves an Industry-Leading Thinness of 0.7 mm through Its EIA 0603 Size Wire-Wound Power Inductor Expanding its Lineup for Compact Mobile Devices while Combining Size and Height Reductions with Lower DC Resistance[PDF/299KB]

2010. 04. 26

Product

TAIYO YUDEN’s 0.22mm-Thin Multilayer Ceramic Capacitor Achieves Industry-Leading Capacitance Value of 1µF 0.47µF Capacitance even in a 0.15mm Profile Enables Mounting for Component-Embedded Substrates[PDF/385KB]

2010. 04. 20

Product

TAIYO YUDEN Introduces the World’s First 0.1µF EIA 01005 Size Multilayer Ceramic Capacitor Uses Advanced Materials and Thin Layer Technologies to Achieve High Capacitance in an Ultra Compact Size[PDF/357KB]

2010. 04. 01

Product

New products categories,”SAW/FBAR devices”and “Frontend Modules”are added. They are for mobile communication equipment.

2010. 03. 25

Product

TAIYO YUDEN Introduces World’s First 100µF in EIA 0805 Size Multilayer Ceramic Capacitor Uses Advanced Materials Technology and Thin Layer Technology to Achieve Reduction by about 62% of the Company’s Previous Product Size [PDF/352KB]

2010. 01. 19

Product

TAIYO YUDEN Introduces Two Additional Compact and Low Profile Power Inductors for Mobile Devices Maintaining Industry-Leading DC Bias Characteristics with an Approximate 17% Reduction in Size and Thickness[PDF/343KB]

2010. 01. 06

Product

TAIYO YUDEN Introduces the Low ESL Capacitor Featuring an Industry-High Capacitance of 1µF with 0.3mm Thickness An LW Reversal Decoupling Capacitor Thickness Reduced by 40% Compared with Existing TAIYO YUDEN Products[PDF/353KB]

2010. 11. 05

Notifications

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2010. 11. 05

Notifications

Announcement of Financial Results for the 2nd Quarter of FY2011.

2010. 10. 07

Notifications

Four of the data in “Design Support Tools” section (S-parameter; SPICE model; TAIYO YUDEN Simulator and Taiyo Yuden Components Selection Guide & Data Library)were updated.

2010. 10. 04

Notifications

Update of “TAIYO YUDEN Develops Wireless Module for “TransferJet™” High-Speed Wireless Transfer Technology” in “Press Release”.

2010. 10. 01

Notifications

Update of “TAIYO YUDEN Announces the Successful Development of a Duplexer with Zero Frequency Fluctuation with Temperature” in “Press Release”.

2010. 09. 27

Notifications

Update of “TAIYO YUDEN Announces Details of an Extraordinary Loss due to Structural Reforms Implemented in the Company’s Optical Media Products Business While Revising Its Forecasts of Results” in “Press Release”.

2010. 09. 21

Notifications

Update of “TAIYO YUDEN Announces the Commercial Release of a Power Inductor that Helps to Realize More Compact and Energy Efficient Mobile Devices” in “Press Release”.

2010. 09. 21

Notifications

Update of “TAIYO YUDEN Announces the Commercial Release of Power Inductors thatAchieve Industry-Leading DC Bias Characteristics” in “Press Release”.

2010. 09. 17

Notifications

TAIYO YUDEN will participate in CEATEC 2010.

2010. 09. 15

Notifications

Update of “TAIYO YUDEN Announces the Commercial Release of a Backlight Driver Module for Use in LED TVs” in “Press Release”.

2010. 09. 08

Notifications

Update of “Annual Report 2010” in “IR Library”.

2010. 09. 07

Notifications

Update of “TAIYO YUDEN Presents a Solution to Multilayer Ceramic Capacitor Audible Ringing Problem” in “Press Release”.

2010. 08. 31

Notifications

Update of ”Safety & Environmental Report 2010” in ”Corporate Information”

2010. 08. 23

Notifications

Update of “TAIYO YUDEN Announces the Commercial Release of LW Reversal Decoupling Capacitors Achieves Industry-Leading Capacitance Value of 22µF” in “Press Release”.

2010. 08. 04

Notifications

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2010. 08. 03

Notifications

Update of “TAIYO YUDEN Announces the Commercial Release of a Low Profile PAS Capacitor for LED Flash Used in Compact Mobile Devices” in “Press Release”.

2010. 07. 29

Notifications

Update of “TAIYO YUDEN Introduces a New Multilayer Chip Power Inductor Approximately 72% Smaller than the Company’s Previous Products” in “Press Release”.

2010. 07. 29

Notifications

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010. 07. 26

Notifications

Update of “TAIYO YUDEN Announces Commercial Release of EIA 0805 Size Multilayer Diplexer for Cellular Band Applications” in “Press Release”.

2010. 07. 14

Notifications

Update of “TAIYO YUDEN Announces Commercial Release of Multilayer Dual Low Pass Filter, Industry’s Smallest in its Class” in “Press Release”.

2010. 07. 01

Notifications

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010. 06. 15

Notifications

A new topic, “Power Inductors Ver.2” was added to the Web Seminar section in the Support & Downloads.

2010. 05. 18

Notifications

Update of “TAIYO YUDEN Achieves an Industry-Leading Thinness of 0.7 mm through Its EIA 0603 Size Wire-Wound Power Inductor” in “Press Release”.

2010. 05. 13

Notifications

Update of “TAIYO YUDEN Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results” in “Press Release”.

2010. 05. 13

Notifications

Update of “TAIYO YUDEN Announces Details of the Informal Decision to Appoint Directors” in “Press Release”.

2010. 05. 13

Notifications

Announcement of Financial Results for the FY2010

2010. 05. 07

Notifications

“Taiyo Yuden Components Selection Guide & Data Library” was newly added to the web seminar section in the Support and Downloads.

2010. 04. 28

Notifications

Five of the data in “Support & Downloads” section (S-parameter; SPICE model; Component Library; TAIYO YUDEN Simulator and Taiyo Yuden Components Selection Guide & Data Library) were updated .

2010. 04. 26

Notifications

Update of “TAIYO YUDEN’s 0.22mm-Thin Multilayer Ceramic Capacitor Achieves Industry-Leading Capacitance Value of 1µF” in “Press Release”.

2010. 04. 20

Notifications

Update of “TAIYO YUDEN Introduces the World’s First 0.1µF EIA 01005 Size Multilayer Ceramic Capacitor” in “Press Release”.

2010. 04. 01

Notifications

New categories,”SAW/FBAR devices”and”Frontend Modules”are added to the products lineup.

2010. 03. 31

Notifications

Update of “TAIYO YUDEN Completes Steps to Acquire the Communications Device Business of Fujitsu Media Devices, Making it Subsidiary Company” in “Press Release”.

2010. 03. 31

Notifications

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010. 03. 25

Notifications

Update of “TAIYO YUDEN Introduces World’s First 100µF in EIA 0805 Size Multilayer Ceramic Capacitor” in “Press Release”.

2010. 03. 25

Notifications

Update of “TAIYO YUDEN Announces Personnel Change” in “Press Release”.

2010. 02. 22

Notifications

Update of “Discontinuation of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures)” in “Press Release”.

2010. 02. 12

Notifications

Notification: Website Temporarily Closed.

2010. 02. 09

Notifications

Update of “TAIYO YUDEN Revises Forecasts of Results” in “Press Release”.

2010. 02. 09

Notifications

Announcement of Financial Results for the 3rd Quarter of FY2010.

2010. 02. 02

Notifications

“Taiyo Yuden Components Selection Guide & Data Library” on the Support & Download page was updated in search and display functions

2010. 01. 19

Notifications

Update of “TAIYO YUDEN Introduces Two Additional Compact and Low Profile Power Inductors for Mobile Devices” in “Press Releases”.

2010. 01. 06

Notifications

Update of “TAIYO YUDEN Introduces the Low ESL Capacitor Featuring an Industry-High Capacitance of 1µF with 0.3mm Thickness” in “Press Releases”.