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Press Releases(BackNumber)2010
2010.08.23
Taiyo Yuden Announces the Commercial Release of LW Reversal Decoupling Capacitors Achieves Industry-Leading Capacitance Value of 22µF
Realizing High Capacitance Utilizing Advanced Material and Thin Layer Technologies[PDF/393KB]
2010.08.04
Taiyo Yuden Revises Forecasts of Results[PDF/265KB]
2010.08.03
Taiyo Yuden Announces the Commercial Release of a Low Profile PAS Capacitor for LED Flash Used in Compact Mobile Devices
Bolstering Initiatives Aimed at the Energy Device Market, which is Expected to Experience Growth[PDF/307KB]
2010.07.29
Taiyo Yuden Announces Personnel Change[PDF/114KB]
2010.07.29
Taiyo Yuden Introduces a New Multilayer Chip Power Inductor Approximately 72% Smaller than the Company’s Previous Products
Combining a High Current Rating with Low DC Resistance in an EIA 0603 Size that is 0.55 mm Thin[PDF/294KB]
2010.07.26
Taiyo Yuden Announces Commercial Release of EIA 0805 Size Multilayer Diplexer for Cellular Band Applications
Optimized for Send/Receive Systems of Progressively More Multi-Band Mobile Phones[PDF/299KB]
2010.07.14
Taiyo Yuden Announces Commercial Release of Multilayer Dual Low Pass Filter, Industry’s Smallest in its Class
EIA 0603 Size with the Height of Just 0.45mm Contributes to Compact Smartphones[PDF/223KB]
2010.07.01
Taiyo Yuden Announces Personnel Change[PDF/341KB]
2010.05.18
Taiyo Yuden Achieves an Industry-Leading Thinness of 0.7 mm through Its EIA 0603 Size Wire-Wound Power Inductor
Expanding its Lineup for Compact Mobile Devices while Combining Size and Height Reductions with Lower DC Resistance[PDF/299KB]
2010.05.13
Taiyo Yuden Announces Details of the Informal Decision to Appoint Directors[PDF/177KB]
2010.05.13
Taiyo Yuden Outlines the Reasons for Discrepancies between Consolidated Forecasts and Actual Results[PDF/135KB]
2010.04.26
Taiyo Yuden's 0.22mm-Thin Multilayer Ceramic Capacitor Achieves Industry-Leading Capacitance Value of 1µF
0.47µF Capacitance even in a 0.15mm Profile Enables Mounting for Component-Embedded Substrates[PDF/385KB]
2010.04.20
Taiyo Yuden Introduces the World’s First 0.1µF EIA 01005 Size Multilayer Ceramic Capacitor
Uses Advanced Materials and Thin Layer Technologies to Achieve High Capacitance in an Ultra Compact Size[PDF/357KB]
2010.03.31
Taiyo Yuden Announces Personnel Change[PDF/121KB]
2010.03.31
Taiyo Yuden Completes Steps to Acquire the Communications Device Business of Fujitsu Media Devices, Making it Subsidiary Company[PDF/217KB]
2010.03.25
Taiyo Yuden Announces Personnel Change[PDF/100KB]
2010.03.25
Taiyo Yuden Introduces World's First 100µF in EIA 0805 Size Multilayer Ceramic Capacitor
Uses Advanced Materials Technology and Thin Layer Technology to Achieve Reduction by about 62% of the Company's Previous Product Size
[PDF/352KB]
2010.02.22
Discontinuation of the Company’s Policy on the Large-Scale Purchase of Company Shares (Anti-Takeover Measures)[PDF/106KB]
2010.02.09
Taiyo Yuden Revises Forecasts of Results[PDF/148KB]
2010.01.19
Taiyo Yuden Introduces Two Additional Compact and Low Profile Power Inductors for Mobile Devices
Maintaining Industry-Leading DC Bias Characteristics with an Approximate 17% Reduction in Size and Thickness[PDF/343KB]
2010.01.06
Taiyo Yuden Introduces the Low ESL Capacitor Featuring an Industry-High Capacitance of 1µF with 0.3mm Thickness
An LW Reversal Decoupling Capacitor Thickness Reduced by 40% Compared with Existing Taiyo Yuden Products[PDF/353KB]
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