TAIYO YUDEN

Line up

Wireless LAN

Wireless LAN Module

Picture Part Number IEEE Spec. I/F Bluetooth® Embedded
Crystal
Embedded
Antenna
Certification Operation
Temperature
Eval Board Eval Kit Overview Data
Report
WYSBHVGXG WYSBHVGXG 802.11 ac/a/b/g/n SDIO, PCM V4.2 Yes Yes None -30-85
degree-C
WBSBHVGXG WKSBHVGXG V1.0 V 1.1
WYSAGVDXG WYSAGVDXG 802.11 ac/a/b/g/n SDIO, PCM V4.2 Yes Yes Japan
FCC
ISED
-30-85
degree-C
WBSAGVDXG WKSAGVDXG V1.0 V 1.2
WYSEGVDXG WYSEGVDXG 802.11 ac/a/b/g/n SDIO, PCM V4.2 Yes RF Connector Japan
FCC
ISED
-30-85
degree-C
WBSEGVDXG WKSEGVDXG V1.0 V 1.1
WYSBCVGX7 WYSBCVGX7
(Planned discontinued)
802.11b/g/n SDIO No Yes No None -10-70
degree-C
WBSBCVGXA-1
(Planned discontinued)
V1.0 V1.0
WYSBCVGXA WYSBCVGXA
(Planned discontinued)
802.11b/g/n SDIO, PCM V3.0 Yes No None -10-70
degree-C
WBSBCVGXA-1
(Planned discontinued)
V2.0 V1.0
WYSBMVGX4 WYSBMVGX4
(Planned discontinued)
802.11a/b/g/n SDIO No No No None -20-70
degree-C
WBSBMVGXB-1
(Planned discontinued)
V2.0 V1.0
WYSBMVGX4-I WYSBMVGX4-I
(Planned discontinued)
802.11a/b/g/n SDIO No No No None -30-85
degree-C
WBSBMVGXB-1
(Planned discontinued)
V2.1 V1.0
WYSBMVGXB WYSBMVGXB
(Planned discontinued)
802.11a/b/g/n SDIO, PCM V3.0 No No None -20-70
degree-C
WBSBMVGXB-1
(Planned discontinued)
V2.0 V1.0
WYSAAVDX7 WYSAAVDX7
(Planned discontinued)
802.11b/g/n SDIO No Yes Yes Japan
FCC
IC
-20-80
degree-C
WBSAAVDX7
(Planned discontinued)
V2.0 V1.0
WYSAAVDXB WYSAAVDXB 802.11a/b/g/n SDIO, PCM V3.0 Yes Yes Japan -30-80
degree-C
WBSAAVDXB V1.0 V1.0
WYSAGVDX7 WYSAGVDX7 802.11b/g/n SDIO No Yes Yes Japan
FCC
IC
0-70
degree-C
WBSAGVDX7 V1.0 V1.1

Software Embedded Wireless LAN Module

Picture Part Number IEEE Spec. I/F Processor Software Certification Operation
Temperature
Eval Board Overview Data
Report
WYSACVLXY-XX WYSACVLXY-XX IEEE802.11b/g/n UART Coretex-M4 Integrated Japan
FCC
IC
-30-85
degree-C
WBSACVLXY-1 V1.1 V1.4

Evaluation Tools

Picture Part Number Description Module Overview
WBSBHVGXG
WKSBHVGXG Evaluation Board for WLAN module WYSBHVGXG with SDIO interface.
J-Link Lite attached.
WYSBHVGXG V1.0
WBSBHVGXG Evaluation Board for WLAN module WYSBHVGXG with SDIO interface.
WBSBHVGXG
WKSAGVDXG Evaluation Board for WLAN module WYSAGVDXG with SDIO interface.
J-Link Lite attached.
WYSAGVDXG V1.0
WBSAGVDXG Evaluation Board for WLAN module WYSAGVDXG with SDIO interface.
WBSBHVGXG
WKSEGVDXG Evaluation Board for WLAN module WYSEGVDXG with SDIO interface.
J-Link Lite attached.
WYSEGVDXG V1.0
WBSEGVDXG Evaluation Board for WLAN module WYSEGVDXG with SDIO interface.
WBSBCVGXA-1
WBSBCVGXA-1
(Planned discontinued)
Evaluation Board for WLAN module WYSBCVGX7 and WYSBCVGXA with SDIO interface. WYSBCVGX7
(Planned discontinued)
V2.0
WYSBCVGXA
(Planned discontinued)
V1.0
WBSBMVGXB-1
WBSBMVGXB-1
(Planned discontinued)
Evaluation Board for WLAN module WYSBMVGX4, WYSBMVGX4-I and WYSBMVGXB with SDIO interface. WYSBMVGX4
(Planned discontinued)
V2.0
WYSBMVGX4-I
(Planned discontinued)
V2.1
WYSBMVGXB
(Planned discontinued)
V2.0
WBSAAVDX7
WBSAAVDX7
(Planned discontinued)
Evaluation Board for WLAN module WYSAAVDX7 with SDIO interface. WYSAAVDX7
(Planned discontinued)
V2.0
WBSAGVDX7
WBSAGVDX7 Evaluation Board for WLAN module WYSAGVDX7 with SDIO interface. WYSAGVDX7 V1.0
WBSACVLXY-1
WBSACVLXY-1 Evaluation Board for WLAN module WYSACVLXY-XX with mini USB interface. WYSACVLXY-XX V1.0
WBSAAVDXB
WBSAAVDXB

Evaluation Board for WLAN module WYSAAVDXB with SDIO interface.

WYSAAVDXB V1.0

Bluetooth®

Bluetooth® low energy (BLE) Basic Module

*
Supported by S212 or S332 Softdevice
Supported by default Softdevice
Picture Type Part No. Dimension Soft
Device
RAM Flash I/F CPU Bluetooth®
Version
Crystal ANT
Support
Operation
Temp.
Certification Evaluation
Board
Evaluation
Kit
Overview Data
Report
nRF52840
High-end
Bluetooth®
low energy
Basic Module
EYSKBNZWB 10.0x15.4x2.0 S140
V6.1.0
256KB 1MB USB
UART
SPI
I2C
I2S
PDM
ARM
Cortex
M4F
v5.0 32MHz
32.768kHz
* -40 - +85
deg-C
Japan
U.S.A.
Canada
(CE)


Bluetooth®
Logo
EBSKBNZWB EKSKBNZWB V1.9 1.0
nRF52832
High
Performance
Bluetooth®
low energy
Basic Module
EYSHSNZWZ

3.25x8.55x0.85

S132
V5.0.0
64KB 512KB UART
SPI
I2C
I2S
PDM
ARM
Cortex
M4F
v5.0 32MHz * -40 - +85
deg-C
EBSHSNZWZ EKSHSNZWZ V2.0 V1.5
EYSHCNZWZ 9.6x12.9x2.0 S132
V5.0.0
32MHz
32.768kHz
* EBSHCNZWZ EKSHCNZWZ V2.0 V1.4
EYSHJNZWZ 5.1x11.3x1.3 S132
V5.0.0
32MHz * EBSHJNZWZ EKSHJNZWZ V2.0 V1.5
nRF52810
Low cost
Bluetooth®
low energy
Basic Module
EYSLSNZWW 3.25x8.55x1.00 S112
V5.1.0
24KB 192KB UART
SPI
I2C
PDM
ARM
Cortex
M4
v5.0 32MHz * -40 - +85
deg-C
EBSLSNZWW EKSLSNZWW V1.9 1.0
nRF52810
Low cost
Bluetooth®
low energy
Basic Module
EYSLCNZWW

9.6x12.9x2.0

S112
V5.1.0
24KB 192KB UART
SPI
I2C
PDM
ARM
Cortex
M4
v5.0 32MHz
32.768kHz
* -40 - +85
deg-C
EBSLCNZWW EKSLCNZWW V1.9 V1.1
nRF51
Simple
Bluetooth®
low energy
Basic Module
EYSGCNZXX 9.6x12.9x2.0 S110
V8.0.0
16KB 256KB UART
SPI
I2C
ARM
Cortex
M0
v4.2 32MHz
32.768kHz
  -40 - +85
deg-C
EBSGCNZWY EKSGCNZWY V1.8 V1.9
EYSGCNZWY 9.6x12.9x2.0 S120
V2.1.0
32KB 32MHz
32.768kHz
  -25 - +85
deg-C
EBSGCNZWY EKSGCNZWY V1.8 V1.9
EYSGJNZXX 5.1x11.3x1.3 S110
V8.0.0
16KB 32MHz   -40 - +85
deg-C
EBSGJNZWY EKSGJNZWY V1.8 V2.0
EYSGJNZWY 5.1x11.3x1.3 S120
V2.1.0
32KB 32MHz   -25 - +85
deg-C
EBSGJNZWY EKSGJNZWY V1.8 V2.0
EYAGJNZXX 5.1x11.3x1.3 S310
V3.0.0
32KB 32MHz -25 - +85
deg-C
EBAGJNZXX EKAGJNZXX V1.8 V2.0
nRF52832
High
Performance
Bluetooth®
low energy
Basic Module
EYSHCNZXZ
(NRND)
9.6x12.9x2.0 S132
V2.0.1
64KB 512KB UART
SPI
I2C
I2S
PDM
ARM
Cortex
M4F
v4.2 32MHz
32.768kHz
* -40 - +85
deg-C
EBSHCNZXZ
(Non-Preferred)
EKSHCNZXZ
(Non-Preferred)
V1.8 V1.6
EYSHJNZXZ
(NRND)
5.1x11.3x1.3 S132
V2.0.1
32MHz * EBSHJNZXZ
(Non-Preferred)
EKSHJNZXZ
(Non-Preferred)
V1.8 V1.6
  EYSFCNZXX
(NRND)
9.6x12.9x2.0 S110
V6.0.0
16KB 256KB UART
SPI
I2C
ARM
Cortex
M0
v4.0 32MHz
32.768kHz
  -25 - +75
deg-C
EBSFCNZXX
(Non-Preferred)
EKSFCNZXX
(Non-Preferred)
V1.1 V1.01

NRND : Not Recomend New Design

Bluetooth® low energy (BLE) Application Embedded Module

Picture Type Part No. Dimension Soft
Device
Application I/F CPU Bluetooth®
Version
Crystal DCDC Operation
Temp.
Certification Evaluation
Board
Overview Data
Report
nRF52840
Application
Embedded
Bluetooth®
low energy
Module
EYSKBNUWB-WX 10.0x15.4x2.0 S140
V6.1.0
Embedded
TY's Application
USB
UART
SPI
ARM
Cortex
M4F
v5.0 32MHz
32.768kHz
Suppoted
with
Internal LC
-40 - +85
deg-C
Japan
U.S.A.
Canada
(CE)


Bluetooth®
Logo
EBSKBNUWB-WX V2.0 V1.0
nRF51
Application
Embedded
Bluetooth®
low energy
Module
EYSGCNAWY-VX 9.6x12.9x2.0 S130
V2.0.1
UART ARM
Cortex
M0
v4.2 -25 - +85
deg-C
EBSGCNAWY-VX V1.9 V1.0
EYSGCNAWY-WX
(NRND)
S120
V2.1.0
v4.1 EBSGCNAWY-WX
(NRND)
V1.8 V1.5
EYSGJNAWY-VX 5.1x11.3x1.3 S130
V2.0.1
v4.2 32MHz Suppoted
with
External LC
EBSGJNAWY-VX V1.9 V1.0
EYSGJNAWY-WX
(NRND)
S120
V2.1.0
v4.1 EBSGJNAWY-WX
(NRND)
V1.8 V1.5
EYSGCNAWY-1X
(NRND)
9.6x12.9x2.0 Embedded
TY's Application Lite
32MHz
32.768kHz
LDO mode
only
EBSGCNAWY-1X
(Non-Preferred)
V1.8 V1.7
EYSGJNAWY-1X
(NRND)
5.1x11.3x1.3 32MHz EBSGJNAWY-1X
(Non-Preferred)
V1.8 V1.7

BLE Evaluation Tools

Picture Part Number Description Module Overview
EKSKBNZWB Evaluation Board for Bluetooth® low energy (BLE) module EYSKBNZWB.
J-Link Lite attached.
EYSKBNZWB V0.7
EBSKBNZWB Evaluation Board for Bluetooth® low energy (BLE) module EYSKBNZWB.
EKSHSNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHSNZWZ.
J-Link Lite attached.
EYSHSNZWZ V1.8
EBSHSNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHSNZWZ.
EKSHCNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZWZ.
J-Link Lite attached.
EYSHCNZWZ V1.8
EBSHCNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZWZ.
EKSHJNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZWZ.
J-Link Lite attached.
EYSHJNZWZ V1.8
EBSHJNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZWZ.
EKSLSNZWW Evaluation Board for Bluetooth® low energy (BLE) module EYSLSNZWW.
J-Link Lite attached.
EYSLSNZWW V0.9
EBSLSNZWW Evaluation Board for Bluetooth® low energy (BLE) module EYSLSNZWW.
EKSLCNZWW Evaluation Board for Bluetooth® low energy (BLE) module EYSLCNZWW.
J-Link Lite attached.
EYSLCNZWW V1.8
EBSLCNZWW Evaluation Board for Bluetooth® low energy (BLE) module EYSLCNZWW.
EKSGCNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNZWY.
J-Link Lite attached.
EYSGCNZXX
EYSGCNZWY
V1.8
EBSGCNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNZWY.
EKSGJNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNZWY.
J-Link Lite attached.
EYSGJNZXX
EYSGJNZWY
V1.8
EBSGJNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNZWY.
EKAGJNZXX Evaluation Board for Bluetooth® low energy (BLE) module EYAGJNZXX.
J-Link Lite attached.
EYAGJNZXX V1.8
EBAGJNZXX Evaluation Board for Bluetooth® low energy (BLE) module EYAGJNZXX.
EBSGCNAWY-VX Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNAWY-VX. EYSGCNAWY-VX V1.9
EBSGCNAWY-WX
(NRND)
Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNAWY-WX. EYSGCNAWY-WX
(NRND)
V1.8
EBSGCJNAWY-VX Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNAWY-VX. EYSGJNAWY-VX V1.9
EBSGJNAWY-WX
(NRND)
Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNAWY-WX. EYSGJNAWY-WX
(NRND)
V1.8
EKSHCNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZXZ.
J-Link Lite attached.
EYSHCNZXZ
(NRND)
V1.8
EBSHCNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZXZ.
EKSHJNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZXZ.
J-Link Lite attached.
EYSHJNZXZ
(NRND)
V1.8
EBSHJNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZXZ.
EBSGCNAWY-1X
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNAWY-1X. EYSGCNAWY-1X
(NRND)
V1.8
EBSGJNAWY-1X
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNAWY-1X. EYSGJNAWY-1X
(NRND)
V1.8
EKSFCNZXX EKSFCNZXX
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSFCNZXX.
nRF51822-DK by Nordic attached.
EYSFCNZXX
(NRND)
V1.1
EBSFCNZXX
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSFCNZXX.

GPS

GPS Module

Picture Part No. Dimension Satellite I/F SAW LNA TCXO Antenna
on board
Operation
Temp.
Evaluation Board Overview Data
Report
GYSFFMAXB GYSFFMAXB
(NRND)
10.0x10.8x2.05 GPS
QZSS
SBAS
UART Yes Yes Yes No -30 - +85
deg-C
GKSFFMAXB
(Non-Preferred)
V1.0 V1.4
GYSFFMAXC GYSFFMAXC
(NRND)
10.0x10.8x2.05 GPS
GLONASS
QZSS
SBAS
UART Yes Yes Yes No -30 - +85
deg-C
GBSFFMAXC
(Non-Preferred)
V1.0 V1.2
GYSFDMAXB GYSFDMAXB
(NRND)
15.3x23.2x6.9 GPS
QZSS
SBAS
UART Yes Yes Yes Yes -30 - +85
deg-C
N/A V1.0 V1.0

Evaluation Tools

Picture Part Number Description Module Overview
GKSFFMAXB
GKSFFMAXB
(Non-Preferred)
Evaluation Board for GPS module GYSFFMAXB with UART interface. GYSFFMAXB
(NRND)
V1.4
GBSFFMAXC
GBSFFMAXC
(Non-Preferred)
Evaluation Board for GPS module GYSFFMAXC with UART interface. GYSFFMAXC
(NRND)
V1.2

Sub-1GHz

Software Embedded Sub-1GHz Module

Picture Part Number IEEE Spec. I/F Processor Software Certification Operation
Temperature
Eval Board Overview Data
Report
SYSFCSAXX-XX SYSFCSAXX-XX

IEEE802.15.4g/e

UART

Cortex-M3

Integrated JAPAN -20 - +70
degree-C
SBSFCSAXX V1.0 V1.0

Evaluation Tools

Picture Part Number Description Module Overview
SBSFCSAXX
SBSFCSAXX

Evaluation Board for Sub-1GHz module SYSFCSAXX-XX with UART interface

SYSFCSAXX-XX V1.0