TAIYO YUDEN

WYSEGVDXG

Wireless Module
802.11ac/a/b/g/n & Bluetooth®
Part Number
WYSEGVDXG
Status
Mass Production
Evaluation Board
WBSEGVDXG

Evaluation Board for WLAN module WYSEGVDXG with SDIO interface.
It is necessary to prepare PC with SDIO I/F.

Evaluation Kit
WKSEGVDXG

Host processor (ESPRESSObin) is attached to this kit.
It is not necessary to prepare PC with SDIO I/F.

Key Features

  • SMD type module.
  • IEEE802.11ac/a/b/g/n 1×1 conformity. Data rates up to MCS9(433.3Mbps)
  • BT4.2(supports Bluetooth® Low Energy). Class2 supports.
  • Low standby current (with low power operation)
  • Transmit data rate : 11/5.5/2/1 Mbps(11b), 54/48/36/24/18/12/9/6 Mbps(11a/g), 150~6.5 Mbps (11n, MCS7~0, HT20/40), 433.3 ~ 7.22 Mbps (11ac MCS9~0, HT80 )
  • Channel Number : 1 to 13 channel (11bgn), W52/W53/W56/W58(11ac/11an), 79 channel (BT), 40 channel (BLE)
  • Interface : SDIO3.0, PCM
  • Built-in Diplexer, 2G-PA, 5G-PA, 5G-LNA, OTP, X`tal, DC/DC Power
  • Security: TKIP, WEP, AES, CCMP, CMAC, WAPI, WPA/WPA2(64bit/128bit)
  • Outline: 24.0 x 11.5 x2.0 (Max) mm
  • Package: Metal case package
  • Japan, FCC and ISED qualified
  • RoHS Conformity

for Detail

Document Name Version Date
Overview V1.1 2020/06/05
Data Report V1.5 2020/09/04
Application Note V1.1 2020/06/25
Evaluation Board Manual V1.3 2020/06/22
Evaluation Kit Manual V1.2 2020/06/19
Antenna List Rev.6 2020/09/17
FAQ V1.0 2020/05/11
Module CAD Data 2020/07/22