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Product Information News

2012

2012.12.17

Products

TAIYO YUDEN Announces New Low Profile Enhancements to its Metal Power Inductors MCOIL(TM) Product Line-up

2012.12.03

Products

New topics added to the “Technical Presentations”.

2012.11.01

Products

TAIYO YUDEN Announces an EIA 0603 Size Chip Bead Inductor with the Highest Current Rating in the Industry[PDF/483KB]

2012.09.25

Products

TAIYO YUDEN Announces the Commercial Release of its EIA 0201 Size Multilayer Ceramic Capacitor with a 2.2μF Capacitance[PDF/641KB]

2012.09.13

Products

TAIYO YUDEN Announces Cylinder Type Lithium Ion Capacitor Capable of Operating up to 85ºC[PDF/538KB]

2012.08.28

Products

TAIYO YUDEN Announces the Commercial Production of a High Temperature Cylinder Type Polyacene Capacitor Guaranteed to Operate up to 70ºC[PDF/524KB]

2012.08.23

Products

TAIYO YUDEN Announces the EIA 01005 Size High Frequency Multilayer Ceramic Capacitor with a Rated Voltage of 25V[PDF/628KB]

2012.08.23

Products

TAIYO YUDEN Announces the EIA 01005 Size High Frequency Multilayer High-Q Chip Inductor[PDF/462KB]

2012.07.31

Products

TAIYO YUDEN Announces the Expanded Lineup of Multilayer Chip Bead Inductors for Smartphones[PDF/569KB]

2012.07.23

Products

TAIYO YUDEN Announces the Commercialization of a 4mm Square Metal Power Inductor “MCOILTM”[PDF/460KB]

2012.07.23

Products

TAIYO YUDEN Announces the Commercial Release of High Frequency Multilayer High Q Chip Inductor with Industry Best Q-Value[PDF/434KB]

2012.07.06

Products

The topic of “High Frequency Products” is added to the Technical Presentations.

2012.06.11

Products

TAIYO YUDEN Announces an EIA 0603 size Multilayer Ceramic Capacitor with a 47μF Capacitance[PDF/467KB]

2012.05.10

Products

TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]

2012.04.23

Products

“EOMIN” and “SAW devices” are added to the technical presentations page.

2012.04.16

Products

TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]