Review of Operations

Business Overview

In the past few years, the TAIYO YUDEN Group has been working to transform its business focus from the module business to an integrated modules & devices business. We are focusing particularly on enhancing our position in the communication device and energy-related fields.

Business Performance in the Year Ended March 2013

Sales in the Integrated Modules & Devices business rose 3.8% year over year to ¥47,804 million. Sales of power supply and high frequency modules were lower as compared to the previous fiscal year. This was offset by the increase in sales of SAW/FBAR devices for mobile communications.

Key Initiatives in the Year Ended March 2013

In SAW/FBAR devices for mobile communications, technology has become a key element in the devices that support the smartphone market, and the TAIYO YUDEN Group is working hard to develop products in this segment. We are making proposals for miniaturized, low energy-consumption filter devices that support LTE, and front-end modules with value-added integrated circuits. The Group is also focusing its efforts on developing products that use FBAR technology to support more highly functional devices.
The Group worked to develop multifunctional modules that have superior compactness, a low profile and high efficiency, in order to address growing power conservation needs.
With regard to wireless communication modules, the Group also concentrated on developing and commercializing combination modules that enable the same module to be compatible with different communications standards such as Bluetooth® and wireless LAN. The Group also made new proposals to the communications market, including the healthcare and other fields.

Initiatives Ahead

The Group is developing a high frequency module business centered on SAW/FBAR technology, while building a production base in response to rising demand from the growing smartphone and tablet device markets, where we see an increasing need for a greater number of embedded SAW/FBAR devices per product.
The Group is also aggressively targeting the market for super high-end components with products such as the EOMIN™ embedded-parts multilayer wiring substrate (“component-on-chip”).
Furthermore, the Group is strengthening the power supply business with recovery systems and other products for the energy market.

Main Products

SAW/FBAR devices for mobile communications, power supply modules, high frequency modules and embedded parts multilayer wiring substrate

• SAW/FBAR devices for mobile communications
• High frequency modules
• Embedded-parts multilayer wiring substrate EOMIN™