- 2010.10.04
TAIYO YUDEN Develops Wireless Module for “TransferJet™” High-Speed Wireless Transfer Technology Half-Mini Card Size Enables Easy Implementation of TransferJet™ Support in Notebook Computers[PDF/246KB]
- 2010.10.01
TAIYO YUDEN Announces the Successful Development of a Duplexer with Zero Frequency Fluctuation with Temperature Development Aimed at the 3rd to 3.9th Generation Mobile Phone 1.8 GHz-Band Communication Systems Such As the W-CDMA BAND III[PDF/307KB]
- 2010.09.21
TAIYO YUDEN Announces the Commercial Release of Power Inductors thatAchieve Industry-Leading DC Bias Characteristics DC Resistance and DC Bias Characteristics Substantially Improved Compared with Existing Products[PDF/343KB]
- 2010.09.21
TAIYO YUDEN Announces the Commercial Release of a Power Inductor that Helps to Realize More Compact and Energy Efficient Mobile Devices Improving DC Resistance and High Frequency Characteristics to Enhance DC-DC Converter Efficiency[PDF/316KB]
- 2010.09.15
TAIYO YUDEN Announces the Commercial Release of a Backlight Driver Module for Use in LED TVs Compatible with a Variety of Functions Including 3D-Image Mode and Local Dimming[PDF/274KB]
- 2010.09.07
TAIYO YUDEN Presents a Solution to Multilayer Ceramic Capacitor Audible Ringing Problem Rated for Same 10 µF Capacitance, New Capacitors Reduce Physical Distortion to One Half Compared to Predecessor Products[PDF/330KB]
- 2010.08.23
TAIYO YUDEN Announces the Commercial Release of LW Reversal Decoupling Capacitors Achieves Industry-Leading Capacitance Value of 22µF Realizing High Capacitance Utilizing Advanced Material and Thin Layer Technologies[PDF/393KB]
- 2010.08.03
TAIYO YUDEN Announces the Commercial Release of a Low Profile PAS Capacitor for LED Flash Used in Compact Mobile Devices Bolstering Initiatives Aimed at the Energy Device Market, which is Expected to Experience Growth[PDF/307KB]
- 2010.07.29
TAIYO YUDEN Introduces a New Multilayer Chip Power Inductor Approximately 72% Smaller than the Company’s Previous Products Combining a High Current Rating with Low DC Resistance in an EIA 0603 Size that is 0.55 mm Thin[PDF/294KB]
- 2010.07.26
TAIYO YUDEN Announces Commercial Release of EIA 0805 Size Multilayer Diplexer for Cellular Band Applications Optimized for Send/Receive Systems of Progressively More Multi-Band Mobile Phones[PDF/299KB]
- 2010.07.14
TAIYO YUDEN Announces Commercial Release of Multilayer Dual Low Pass Filter, Industry’s Smallest in its Class EIA 0603 Size with the Height of Just 0.45mm Contributes to Compact Smartphones[PDF/223KB]
- 2010.05.18
TAIYO YUDEN Achieves an Industry-Leading Thinness of 0.7 mm through Its EIA 0603 Size Wire-Wound Power Inductor Expanding its Lineup for Compact Mobile Devices while Combining Size and Height Reductions with Lower DC Resistance[PDF/299KB]
- 2010.04.26
TAIYO YUDEN’s 0.22mm-Thin Multilayer Ceramic Capacitor Achieves Industry-Leading Capacitance Value of 1µF 0.47µF Capacitance even in a 0.15mm Profile Enables Mounting for Component-Embedded Substrates[PDF/385KB]
- 2010.04.20
TAIYO YUDEN Introduces the World’s First 0.1µF EIA 01005 Size Multilayer Ceramic Capacitor Uses Advanced Materials and Thin Layer Technologies to Achieve High Capacitance in an Ultra Compact Size[PDF/357KB]
- 2010.04.01
New products categories,”SAW/FBAR devices”and “Frontend Modules”are added. They are for mobile communication equipment.
- 2010.03.25
TAIYO YUDEN Introduces World’s First 100µF in EIA 0805 Size Multilayer Ceramic Capacitor Uses Advanced Materials Technology and Thin Layer Technology to Achieve Reduction by about 62% of the Company’s Previous Product Size [PDF/352KB]
- 2010.01.19
TAIYO YUDEN Introduces Two Additional Compact and Low Profile Power Inductors for Mobile Devices Maintaining Industry-Leading DC Bias Characteristics with an Approximate 17% Reduction in Size and Thickness[PDF/343KB]
- 2010.01.06
TAIYO YUDEN Introduces the Low ESL Capacitor Featuring an Industry-High Capacitance of 1µF with 0.3mm Thickness An LW Reversal Decoupling Capacitor Thickness Reduced by 40% Compared with Existing TAIYO YUDEN Products[PDF/353KB]
