- 2012.12.17
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TAIYO YUDEN Announces New Low Profile Enhancements to its Metal Power Inductors MCOIL(TM) Product Line-up
- 2012.12.03
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New topics added to the “Technical Presentations”.
- 2012.11.01
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TAIYO YUDEN Announces an EIA 0603 Size Chip Bead Inductor with the Highest Current Rating in the Industry[PDF/483KB]
- 2012.09.25
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TAIYO YUDEN Announces the Commercial Release of its EIA 0201 Size Multilayer Ceramic Capacitor with a 2.2μF Capacitance[PDF/641KB]
- 2012.09.13
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TAIYO YUDEN Announces Cylinder Type Lithium Ion Capacitor Capable of Operating up to 85ºC[PDF/538KB]
- 2012.08.28
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TAIYO YUDEN Announces the Commercial Production of a High Temperature Cylinder Type Polyacene Capacitor Guaranteed to Operate up to 70ºC[PDF/524KB]
- 2012.08.23
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TAIYO YUDEN Announces the EIA 01005 Size High Frequency Multilayer Ceramic Capacitor with a Rated Voltage of 25V[PDF/628KB]
- 2012.08.23
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TAIYO YUDEN Announces the EIA 01005 Size High Frequency Multilayer High-Q Chip Inductor[PDF/462KB]
- 2012.07.31
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TAIYO YUDEN Announces the Expanded Lineup of Multilayer Chip Bead Inductors for Smartphones[PDF/569KB]
- 2012.07.19
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TAIYO YUDEN Announces the Commercialization of a 4mm Square Metal Power Inductor “MCOILTM”[PDF/460KB]
- 2012.07.18
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TAIYO YUDEN Announces the Commercial Release of High Frequency Multilayer High Q Chip Inductor with Industry Best Q-Value[PDF/434KB]
- 2012.07.06
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The topic of “High Frequency Products” is added to the Technical Presentations.
- 2012.06.11
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TAIYO YUDEN Announces an EIA 0603 size Multilayer Ceramic Capacitor with a 47μF Capacitance[PDF/467KB]
- 2012.05.10
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TAIYO YUDEN Announces Commercial Production of Metal Power Inductor “MCOIL TM”, Optimal for Smartphones[PDF/431KB]
- 2012.04.23
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“EOMIN” and “SAW devices” are added to the technical presentations page.
- 2012.04.16
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TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs Contributing to smartphone camera module miniaturization, 20% thinner substrates[PDF/549KB]