TAIYO YUDEN

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Wireless LAN

Wireless LAN Module

Picture Part Number IEEE Spec. I/F Bluetooth Embedded
Crystal
Embedded
Antenna
Certification Operation
Temperature
Eval Board Overview Data
Report
WYSBHVGXG
WYSBHVGXG 802.11 ac/a/b/g/n SDIO, PCM V4.2 Yes No None -30-85
degree-C
WBSBHVGXG V1.0 V 1.2
WYSBCVGX7
WYSBCVGX7
(Planned discontinued)
802.11b/g/n SDIO No Yes No None -10-70
degree-C
WBSBCVGXA-1
(Planned discontinued)
V1.0 V1.0
WYSBCVGXA
WYSBCVGXA
(Planned discontinued)
802.11b/g/n SDIO, PCM V3.0 Yes No None -10-70
degree-C
WBSBCVGXA-1
(Planned discontinued)
V2.0 V1.0
WYSBMVGX4
WYSBMVGX4 802.11a/b/g/n SDIO No No No None -20-70
degree-C
WBSBMVGXB-1 V2.0 V1.0
WYSBMVGX4-I
WYSBMVGX4-I 802.11a/b/g/n SDIO No No No None -30-85
degree-C
WBSBMVGXB-1 V2.1 V1.0
WYSBMVGXB
WYSBMVGXB 802.11a/b/g/n SDIO, PCM V3.0 No No None -20-70
degree-C
WBSBMVGXB-1 V2.0 V1.0
WYSAAVDX7
WYSAAVDX7 802.11b/g/n SDIO No Yes Yes Japan
FCC
IC
-20-80
degree-C
WBSAAVDX7 V2.0 V1.0
WYSAAVDXB
WYSAAVDXB 802.11a/b/g/n SDIO, PCM V3.0 Yes Yes Japan -30-80
degree-C
WBSAAVDXB V1.0 V1.1
WYSAGVDX7
WYSAGVDX7 802.11b/g/n SDIO No Yes Yes Japan
FCC
IC
0-70
degree-C
WBSAGVDX7 V1.0 V1.1

Software Embedded Wireless LAN Module

Picture Part Number IEEE Spec. I/F Processor Software Certification Operation
Temperature
Eval Board Overview Data
Report
WYSACVLXY-XX
WYSACVLXY-XX IEEE802.11b/g/n UART Coretex-M4 Integrated Japan
FCC
IC
-30-85
degree-C
WBSACVLXY-1 V1.1 V1.5

Evaluation Tools

Picture Part Number Description Module Overview
WBSBHVGXG
WBSBHVGXG Evaluation Board for WLAN module WYSBHVGXG with SDIO interface. WYSBHVGXG V1.0
WBSBCVGXA-1
WBSBCVGXA-1
(Planned discontinued)
Evaluation Board for WLAN module WYSBCVGX7 and WYSBCVGXA with SDIO interface. WYSBCVGX7
(Planned discontinued)
V2.0
WYSBCVGXA
(Planned discontinued)
V1.0
WBSBMVGXB-1
WBSBMVGXB-1 Evaluation Board for WLAN module WYSBMVGX4, WYSBMVGX4-I and WYSBMVGXB with SDIO interface. WYSBMVGX4 V2.0
WYSBMVGX4-I V2.1
WYSBMVGXB V2.0
WBSAAVDX7
WBSAAVDX7 Evaluation Board for WLAN module WYSAAVDX7 with SDIO interface. WYSAAVDX7 V2.0
WBSAGVDX7
WBSAGVDX7 Evaluation Board for WLAN module WYSAGVDX7 with SDIO interface. WYSAGVDX7 V1.0
WBSACVLXY-1
WBSACVLXY-1 Evaluation Board for WLAN module WYSACVLXY-XX with mini USB interface. WYSACVLXY-XX V1.0
WBSAAVDXB
WBSAAVDXB

Evaluation Board for WLAN module WYSAAVDXB with SDIO interface.

WYSAAVDXB V1.0

Bluetooth®

Bluetooth® low energy (BLE) Basic Module

*
Supported by S212 or S332 Softdevice
Supported by default Softdevice
Picture Type Part No. Dimension Soft
Device
RAM Flash I/F CPU Bluetooth
Version
Crystal ANT
Support
Operation
Temp.
Certification Evaluation
Board
Evaluation
Kit
Overview Data
Report
nRF52
High
Performance
Bluetooth
low energy
Basic Module
EYSHSNZWZ

3.25x8.55x0.9

S132
V5.0.0
64KB 512KB UART
SPI
I2C
I2S
PDM
ARM
Cortex
M4F
v5.0 32MHz * -40 - +85
deg-C
Japan
U.S.A.
Canada
(CE)


Bluetooth
Logo
EBSHSNZWZ EKSHSNZWZ V1.7 V1.1
EYSHCNZWZ 9.6x12.9x2.0 S132
V5.0.0
32MHz
32.768kHz
* EBSHCNZWZ EKSHCNZWZ V1.7 V1.1
EYSHJNZWZ 5.1x11.3x1.3 S132
V5.0.0
32MHz * EBSHJNZWZ EKSHJNZWZ V1.7 V1.1
nRF51
Simple
Bluetooth
low energy
Basic Module
EYSGCNZXX 9.6x12.9x2.0 S110
V8.0.0
16KB 256KB UART
SPI
I2C
ARM
Cortex
M0
v4.2 32MHz
32.768kHz
  -40 - +85
deg-C
EBSGCNZWY EKSGCNZWY V1.7 V1.7
EYSGCNZWY 9.6x12.9x2.0 S120
V2.1.0
32KB 32MHz
32.768kHz
  -25 - +85
deg-C
EBSGCNZWY EKSGCNZWY V1.7 V1.7
EYSGJNZXX 5.1x11.3x1.3 S110
V8.0.0
16KB 32MHz   -40 - +85
deg-C
EBSGJNZWY EKSGJNZWY V1.7 V1.7
EYSGJNZWY 5.1x11.3x1.3 S120
V2.1.0
32KB 32MHz   -25 - +85
deg-C
EBSGJNZWY EKSGJNZWY V1.7 V1.7
EYAGJNZXX 5.1x11.3x1.3 S310
V3.0.0
32KB 32MHz -25 - +85
deg-C
EBAGJNZXX EKAGJNZXX V1.7 V1.7
nRF52
High
Performance
Bluetooth
low energy
Basic Module
EYSHCNZXZ 9.6x12.9x2.0 S132
V2.0.1
64KB 512KB UART
SPI
I2C
I2S
PDM
ARM
Cortex
M4F
v4.2 32MHz
32.768kHz
* -40 - +85
deg-C
EBSHCNZXZ EKSHCNZXZ V1.7 V1.4
EYSHJNZXZ 5.1x11.3x1.3 S132
V2.0.1
32MHz * EBSHJNZXZ EKSHJNZXZ V1.7 V1.3
  EYSFCNZXX
(NRND)
9.6x12.9x2.0 S110
V6.0.0
16KB 256KB UART
SPI
I2C
ARM
Cortex
M0
v4.0 32MHz
32.768kHz
  -25 - +75
deg-C
EBSFCNZXX
(NRND)
EKSFCNZXX
(NRND)
V1.1 V1.41

NRND : Not Recomend New Design

Bluetooth® low energy (BLE) Application Embedded Module

Picture Type Part No. Dimension Soft
Device
Application I/F CPU Bluetooth
Version
Crystal DCDC Operation
Temp.
Certification Evaluation
Board
Overview Data
Report
nRF51
Application
Embedded
Bluetooth
low energy
Module
EYSGCNAWY-WX 9.6x12.9x2.0 S120
V2.1.0
Embedded
TY's Application
UART ARM
Cortex
M0
v4.1 32MHz
32.768kHz
Suppoted
with
Internal LC
-25 - +85
deg-C
Japan
U.S.A.
Canada
(CE)


Bluetooth
Logo
EBSGCNAWY-WX V1.7 V1.3
EYSGJNAWY-WX 5.1x11.3x1.3 Embedded
TY's Application
32MHz Suppoted
with
External LC
EBSGJNAWY-WX V1.7 V1.3
EYSGCNAWY-1X 9.6x12.9x2.0 Embedded
TY's Application Lite
32MHz
32.768kHz
LDO mode
only
EBSGCNAWY-1X V1.7 V1.7
EYSGJNAWY-1X 5.1x11.3x1.3 Embedded
TY's Application Lite
32MHz LDO mode
only
EBSGJNAWY-1X V1.7 V1.7

BLE Evaluation Tools

Picture Part Number Description Module Overview
EKSHSNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHSNZWZ.
J-Link Lite attached.
EYSHSNZWZ V1.7
EBSHSNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHSNZWZ.
EKSHCNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZWZ.
J-Link Lite attached.
EYSHCNZWZ V1.7
EBSHCNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZWZ.
EKSHJNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZWZ.
J-Link Lite attached.
EYSHJNZWZ V1.7
EBSHJNZWZ Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZWZ.
EKSGCNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNZWY.
J-Link Lite attached.
EYSGCNZXX
EYSGCNZWY
V1.7
EBSGCNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNZWY.
EKSGJNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNZWY.
J-Link Lite attached.
EYSGJNZXX
EYSGJNZWY
V1.7
EBSGJNZWY Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNZWY.
EKAGJNZXX Evaluation Board for Bluetooth® low energy (BLE) module EYAGJNZXX.
J-Link Lite attached.
EYAGJNZXX V1.7
EBAGJNZXX Evaluation Board for Bluetooth® low energy (BLE) module EYAGJNZXX.
EBSGCNAWY-1X Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNAWY-1X. EYSGCNAWY-1X V1.7
EBSGJNAWY-1X Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNAWY-1X. EYSGJNAWY-1X V1.7
EBSGCNAWY-WX Evaluation Board for Bluetooth® low energy (BLE) module EYSGCNAWY-WX. EYSGCNAWY-WX V1.7
EBSGJNAWY-WX Evaluation Board for Bluetooth® low energy (BLE) module EYSGJNAWY-WX. EYSGJNAWY-WX V1.7
EKSHCNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZXZ.
J-Link Lite attached.
EYSHCNZXZ
(Non-Preferred)
V1.7
EBSHCNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHCNZXZ.
EKSHJNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZXZ.
J-Link Lite attached.
EYSHJNZXZ
(Non-Preferred)
V1.7
EBSHJNZXZ
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSHJNZXZ.
EKSFCNZXX
EKSFCNZXX
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSFCNZXX.
nRF51822-DK by Nordic attached.
EYSFCNZXX
(Non-Preferred)
V1.1
EBSFCNZXX
(Non-Preferred)
Evaluation Board for Bluetooth® low energy (BLE) module EYSFCNZXX.

GPS

GPS Module

Picture Part No. Dimension Satellite I/F SAW LNA TCXO Antenna
on board
Operation
Temp.
Evaluation Board Overview Data
Report
GYSFFMAXB
GYSFFMAXB 10.0x10.8x2.05 GPS
QZSS
SBAS
UART Yes Yes Yes No -30 - +85
deg-C
GKSFFMAXB V1.0 V1.6
GYSFFMAXC
GYSFFMAXC 10.0x10.8x2.05 GPS
GLONASS
QZSS
SBAS
UART Yes Yes Yes No -30 - +85
deg-C
GBSFFMAXC V1.0 V1.1
GYSFDMAXB GYSFDMAXB 15.3x23.2x6.9 GPS
QZSS
SBAS
UART Yes Yes Yes Yes -30 - +85
deg-C
N/A V1.0 V1.0

Evaluation Tools

Picture Part Number Description Module Overview
GKSFFMAXB
GKSFFMAXB Evaluation Board for GPS module GYSFFMAXB with UART interface. GYSFFMAXB V1.6
GBSFFMAXC
GBSFFMAXC Evaluation Board for GPS module GYSFFMAXC with UART interface. GYSFFMAXC V1.1